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TPS92661-Q1 Datasheet(PDF) 5 Page - Texas Instruments |
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TPS92661-Q1 Datasheet(HTML) 5 Page - Texas Instruments |
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5 / 53 page  5 TPS92661-Q1 www.ti.com SLUSBU2A – SEPTEMBER 2014 – REVISED FEBRUARY 2016 Product Folder Links: TPS92661-Q1 Submit Documentation Feedback Copyright © 2014–2016, Texas Instruments Incorporated (1) AEC Q100-002 indicates HBM stressing is done in accordance with the ANSI/ESDA/JEDEC JS-001 specification. 6.2 ESD Ratings MIN MAX UNIT V(ESD) Electrostatic discharge Human body model (HBM), per AEC Q100-002 (1) –2000 2000 V Charged device model (CDM), per AEC Q100- 011 All Pins –750 750 (1) Minimum fclk is applicable only when CKWEN bit is set. fclk as low as 0 Hz is possible when bit is not set. 6.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN NOM MAX UNIT VIN Supply input voltage range 4.5 5.5 V VI Input voltage range per channel LEDx to LED(x-1) 5.0 V IO Output current range LEDx to LED(x-1), continuous 2.0 A LEDx to LED(x-1), pulsed, 1-ms duration 4.0 fCLK CLK frequency(1) 0.1 16 MHz DCLK CLK duty cycle 40% 60% tEW EN input pulse width low 50 ns tESS EN setup to serial start 24/fCLK s tSW SYNC input pulse width 1/fCLK s VIH High-level input voltage 1.9 VVCC + 0.3 V V VIL Low-level input voltage GND – 0.3 V 0.8 V TA Ambient temperature –40 125 °C TJ Junction temperature –40 150 °C (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953. 6.4 Thermal Information THERMAL METRIC(1) TPS92661-Q1 UNITS TQFP (PHP) 48 Pins RθJA Junction-to-ambient thermal resistance 25.7 °C/W RθJC(top) Junction-to-case (top) thermal resistance 10.5 RθJB Junction-to-board thermal resistance 6.1 ψJT Junction-to-top characterization parameter 0.2 ψJB Junction-to-board characterization parameter 6.0 RθJC(bot) Junction-to-case (bottom) thermal resistance 0.3 |
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