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TPS92515QDGQRQ1 Datasheet(PDF) 4 Page - Texas Instruments |
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TPS92515QDGQRQ1 Datasheet(HTML) 4 Page - Texas Instruments |
4 / 39 page 4 TPS92515, TPS92515-Q1, TPS92515HV, TPS92515HV-Q1 SLUSBZ6A – APRIL 2016 – REVISED AUGUST 2016 www.ti.com Product Folder Links: TPS92515 TPS92515-Q1 TPS92515HV TPS92515HV-Q1 Submit Documentation Feedback Copyright © 2016, Texas Instruments Incorporated (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) DRN to SW. Absolute maximum not to be exceeded. 7 Specifications 7.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) MIN MAX UNIT VIN, DRN, CSN to GND TPS92515, TPS92515-Q1 –0.3 45.0 V TPS92515HV, TPS92515HV-Q1 –0.3 65.0 SW to GND TPS92515, TPS92515-Q1 -1.0 45.0 TPS92515HV, TPS92515HV-Q1 -1.0 65.0 DRN to SW TPS92515, TPS92515-Q1 –0.3 45.0 TPS92515HV, TPS92515HV-Q1 –0.3 65.0 BOOT to GND TPS92515, TPS92515-Q1 –0.3 50.5 TPS92515HV, TPS92515HV-Q1 –0.3 70.5 COFF, IADJ, PWM to GND –0.3 5.5 BOOT to SW –0.3 5.5 VCC to GND -0.3 5.5 VIN to CSN –0.3 0.3 SW to GND, 10-ns transient (2) –2.0 Storage temperature, Tstg -40 150 °C (1) AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification. 7.2 ESD Ratings VALUE UNIT V(ESD) Electrostatic discharge Human-body model (HBM), per AEC Q100-002(1) ±2000 V Charged-device model (CDM), per AEC Q100-011 ±750 7.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN NOM MAX UNIT VIN Input voltage TPS92515, TPS92515-Q1 5.5 42 V TPS92515HV, TPS92515HV-Q1 5.5 65 TA Operating ambient temperature 125 °C TJ Operating junction temperature 150 °C (1) For more information about traditional and new thermal metrics, see the Semiconductor and device Package Thermal Metrics application report, SPRA953. 7.4 Thermal Information THERMAL METRIC(1) TPS92515 UNIT HVSSOP 10 PINS RθJA Junction-to-ambient thermal resistance 56.2 °C/W RθJC(top) Junction-to-case (top) thermal resistance 44.7 °C/W RθJB Junction-to-board thermal resistance 32.1 °C/W ψJT Junction-to-top characterization parameter 1.5 °C/W ψJB Junction-to-board characterization parameter 31.8 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance 5.3 °C/W |
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