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KAC-12040-CBA-JD-AE Datasheet(PDF) 4 Page - ON Semiconductor |
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KAC-12040-CBA-JD-AE Datasheet(HTML) 4 Page - ON Semiconductor |
4 / 41 page KAC−12040 www.onsemi.com 4 Physical Orientation Figure 3. Package Pin Orientation − Top X-Ray View LVDS Bank 2 LVDS Bank 4 LVDS Bank 6 LVDS Bank 3 LVDS Bank 5 LVDS Bank 7 A B C D E AA AB AC AD AE 27 26 25 24 23 22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 27 26 25 24 23 22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 1. The center of the pixel array is aligned to the physical package center. 2. The region under the sensor die is clear of pins enabling the use of a heat sink. 3. Non-symmetric mounting holes provide orientation and mounting precision. 4. Non-symmetric pins prevent incorrect placement in PCB. 5. Letter “F” indicator shows default readout direction relative to package pin 1. Notes: |
Similar Part No. - KAC-12040-CBA-JD-AE |
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Similar Description - KAC-12040-CBA-JD-AE |
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