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IW1816-20-SO7 Datasheet(PDF) 4 Page - Dialog Semiconductor

Part # IW1816-20-SO7
Description  Off-Line Digital Green-Mode PWM Controller Integrated
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Manufacturer  DIALOG [Dialog Semiconductor]
Direct Link  http://www.dialog-semiconductor.com/
Logo DIALOG - Dialog Semiconductor

IW1816-20-SO7 Datasheet(HTML) 4 Page - Dialog Semiconductor

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iW1816
Off-Line Digital Green-Mode PWM Controller
Integrated with Power BJT and OTP
Rev. 1.0
Datasheet
© 2016 Dialog Semiconductor
www.dialog-semiconductor.com
4 of 18
30-Jun-2016
Absolute maximum ratings are the parameter values or ranges which can cause permanent damage if exceeded. For
maximum safe operating conditions, refer to Electrical Characteristics in Section 7.0. (TA = 25°C, unless otherwise
noted). Proper design precautions must be made to ensure that the internal die junction temperature of the iW1816
does not exceed 150°C. Otherwise permanent damage to the device may occur.
5 Absolute Maximum Ratings
Parameter
Symbol
Value
Units
DC supply voltage range (pin 4, ICC = 20mA max)
VCC
-0.3 to 18
V
Continuous DC supply current at VCC pin (VCC = 15V)
ICC
20
mA
VSENSE input (pin 6, IVsense ≤ 10mA)
-0.7 to 4.0
V
ISENSE input (pin 7)
-0.3 to 4.0
V
ESD rating per JEDEC JESD22-A114
±2,000
V
Latch-up test per JESD78A
±100
mA
Collector-Emitter breakdown voltage
(Emitter and base shorted together; IC = 1mA, REB = 0Ω)
VCES
800
V
Collector current1
IC
1.5
A
Collector peak current1 (tp < 1ms)
ICM
3
A
Maximum junction temperature
TJMAX
150
°C
Storage temperature
TSTG
-55 to 150
°C
Lead temperature during IR reflow for ≤ 15 seconds
TLEAD
260
°C
Notes:
Note 1: Limited by maximum junction temperature.
6 Thermal Characteristics
Parameter
Symbol
Value
Units
Thermal Resistance Junction-to-Ambient1
θJA
132
°C/W
Thermal Resistance Junction-to-GND pin (pin 5)2
ψJB
71
°C/W
Thermal Resistance Junction-to-Collector pin (pin 1)2
ψJ-BJT
49
°C/W
Thermal Shutdown Threshold3
TSD
150
°C
Thermal Shutdown Recovery3
TSD-R
100
°C
Notes:
1. θJA is measured in a one-cubic-foot natural convection chambe.
2. ψJB [Psi Junction to Board] provides an estimation of the die junction temperature relative to the PCB [Board] surface
temperature. ψJ-BJT [Psi Junction to Collector pin] provides an estimation of the die junction temperature relative to the collector
pin [internal BJT Collector] surface temperature. ψJB is measured at the ground pin (pin 5) without using any thermal adhesives..
See Section 10.14 for more information.
3. These parameters are typical and they are guaranteed by design.


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