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MAX14595EWA Datasheet(PDF) 2 Page - Maxim Integrated Products

Part # MAX14595EWA
Description  Low-Power Dual-Channel Logic-Level Translator
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Manufacturer  MAXIM [Maxim Integrated Products]
Direct Link  https://www.maximintegrated.com/en.html
Logo MAXIM - Maxim Integrated Products

MAX14595EWA Datasheet(HTML) 2 Page - Maxim Integrated Products

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MAX14595
Low-Power Dual-Channel Logic-Level Translator
2
Maxim Integrated
Voltages referenced to GND.
VCC, VL, TS .............................................................-0.5V to +6V
IOVCC1, IOVCC2 ................................... -0.5V to +(VCC + 0.5V)
IOVL1, IOVL2 ............................................-0.5V to +(VL + 0.5V)
Short-Circuit Duration IOVCC1, IOVCC2,
IOVL1, IOVL2 to GND ...........................................Continuous
VCC, IOVCC_ Maximum Continuous Current at +110NC ....100mA
VL IOVL_ Maximum Continuous Current at +110NC..........40mA
TS Maximum Continuous Current at +110NC.....................70mA
Continuous Power Dissipation (TA = +70NC)
TDFN (derate 6.2mW/NC above +70NC)......................496mW
WLP (derate 11.8mW/NC above +70NC)......................944mW
Operating Temperature Range.......................... -40NC to +85NC
Storage Temperature Range............................ -65NC to +150NC
Lead Temperature (TDFN only, soldering, 10s) .............+300NC
Soldering Temperature (reflow) ......................................+260NC
TDFN
Junction-to-Ambient Thermal Resistance (BJA) ........162NC/W
Junction-to-Case Thermal Resistance (BJC) ...............20NC/W
WLP
Junction-to-Ambient Thermal Resistance (BJA) ..........85NC/W
ABSOLUTE MAXIMUM RATINGS
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional opera-
tion of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
ELECTRICAL CHARACTERISTICS
(VCC = +1.65V to +5.5V, VL = +0.9V to min(VCC + 0.3V, +3.6V), TA = -40NC to +85NC, unless otherwise noted. Typical values are at
VCC = +3V, VL = +1.2V, and TA = +25NC.) (Notes 2, 3)
PACKAGE THERMAL CHARACTERISTICS (Note 1)
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
POWER SUPPLY
Power Supply Range
VL
0.9
5.5
V
VCC
1.65
5.5
VCC Supply Current
ICC
IOVCC_ = VCC, IOVL_ = VL, TS = VCC
7
15
F
A
VL Supply Current
IL
IOVCC_ = VCC, IOVL_ = VL, TS = VCC
3
6
F
A
VCC Shutdown Supply Current ICC-SHDN
TS = GND
0.4
1
F
A
TS = VCC, VL = GND, IOVCC_ = unconnected
0.4
1
VL Shutdown Supply Current
IL-SHDN
TS = GND
0.1
1
F
A
TS = VL, VCC = GND, IOVL_ = unconnected
0.1
1
IOVCC_, IOVL_ Three-State
Leakage Current
ILEAK
TA = +25NC, TS = GND
0.1
1
F
A
TS Input Leakage Current
ILEAK_TS
TA = +25NC
1
F
A
VCC Shutdown Threshold
VTH_VCC
TS = VL, VCC falling
0.8
1.35
V
VL Shutdown Threshold
VTH_VL
TS = VCC, VL falling, VL = 0.9V
0.25
0.6
0.86
V
VL Above VCC Shutdown
Threshold
VTH_VL-VCC VL rising above VCC, VCC = +1.65V
0.4
0.73
1.1
V
IOVL_ Pullup Resistor
RVL_PU
Inferred from VOHL measurements
3
7.6
12
kI
IOVCC_ Pullup Resistor
RVCC_PU
Inferred from VOHC measurements
3
7.6
12
kI
IOVL_ to IOVCC_ DC
Resistance
RIOVL-IOVCC Inferred from VOLx measurements
6
17
I


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