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TPS72616DCQR Datasheet(PDF) 11 Page - Texas Instruments |
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TPS72616DCQR Datasheet(HTML) 11 Page - Texas Instruments |
11 / 23 page 1 oz. Copper Power Plane 1 oz. Copper Ground Plane 2 oz. Copper Solder Pad with 25 Thermal Vias Thermal Vias, 0,3 mm Diameter, 1,5 mm Pitch 1 2 3 4 5 0.1 1 10 100 Copper Heatsink Area − cm2 TA = 55°C No Air Flow 150 LFM 250 LFM P Dmax + (3.3 * 2.5) V x 1 A + 800 mW TPS726126 TPS72615, TPS72616 TPS72618, TPS72625 www.ti.com SLVS403H – MAY 2002 – REVISED JUNE 2010 Figure 21. DDPAK Thermal Resistance From the data in Figure 22 and rearranging Equation 4, the maximum power dissipation for a different ground plane area and a specific ambient temperature can be computed. Figure 22. Maximum Power Dissipation vs Copper Heatsink Area SOT223 Power Dissipation The SOT223 package provides an effective means of managing power dissipation in surface mount applications. The SOT223 package dimensions are provided in the Mechanical Data section at the end of the data sheet. The addition of a copper plane directly underneath the SOT223 package enhances the thermal performance of the package. To illustrate, the TPS72625 in a SOT223 package was chosen. For this example, the average input voltage is 3.3 V, the output voltage is 2.5 V, the average output current is 1 A, the ambient temperature 55°C, no air flow is present, and the operating environment is the same as documented below. Neglecting the quiescent current, the maximum average power is: (7) Substituting TJmax for TJ into Equation 4 gives Equation 8: Copyright © 2002–2010, Texas Instruments Incorporated Submit Documentation Feedback 11 Product Folder Link(s): TPS726126 TPS72615 TPS72616 TPS72618 TPS72625 |
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