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TPS78601DRBR Datasheet(PDF) 5 Page - Texas Instruments |
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TPS78601DRBR Datasheet(HTML) 5 Page - Texas Instruments |
5 / 37 page TPS786 www.ti.com SLVS389M – SEPTEMBER 2002 – REVISED SEPTEMBER 2015 6.4 Thermal Information TPS786(3) THERMAL METRIC(1)(2) DRB (SON) DCQ (S0T-223) KTT (TO-263) UNIT 8 PINS 6 PINS 5 PINS RθJA Junction-to-ambient thermal resistance 41.1 54.2 40.7 °C/W RθJC(top) Junction-to-case (top) thermal resistance 49.1 33.3 43.1 °C/W RθJB Junction-to-board thermal resistance 16.6 8.9 21.5 °C/W ψJT Junction-to-top characterization parameter 0.7 2.6 9.4 °C/W ψJB Junction-to-board characterization parameter 16.8 8.8 20 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance 5.2 N/A 2.1 °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953. (2) For thermal estimates of this device based on PCB copper area, see the TI PCB Thermal Calculator. (3) Thermal data for the DRB, DCQ, and DRV packages are derived by thermal simulations based on JEDEC-standard methodology as specified in the JESD51 series. The following assumptions are used in the simulations: (a) i. DRB: The exposed pad is connected to the PCB ground layer through a 2×2 thermal via array. . ii. DCQ: The exposed pad is connected to the PCB ground layer through a 3×2 thermal via array. . iii. KTT: The exposed pad is connected to the PCB ground layer through a 5×4 thermal via array. (b) i. DRB: The top and bottom copper layers are assumed to have a 20% thermal conductivity of copper representing a 20% copper coverage. . ii. DCQ: Each of top and bottom copper layers has a dedicated pattern for 20% copper coverage. . iii. KTT: The top and bottom copper layers are assumed to have a 20% thermal conductivity of copper representing a 20% copper coverage. (c) These data were generated with only a single device at the center of a JEDEC high-K (2s2p) board with 3 inches × 3 inches copper area. To understand the effects of the copper area on thermal performance, see the Power Dissipation and Estimating Junction Temperature sections of this data sheet. Copyright © 2002–2015, Texas Instruments Incorporated Submit Documentation Feedback 5 Product Folder Links: TPS786 |
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