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TPS780360200 Datasheet(PDF) 4 Page - Texas Instruments |
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TPS780360200 Datasheet(HTML) 4 Page - Texas Instruments |
4 / 37 page TPS780 SBVS083E – JANUARY 2007 – REVISED JANUARY 2015 www.ti.com 6 Specifications 6.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) MIN MAX UNIT VIN –0.3 +6.0 Voltage VEN and VVSET –0.3 VIN + 0.3 (2) V VOUT –0.3 VIN + 0.3 Current IOUT Internally limited Output short-circuit duration Indefinite Total continuous power dissipation, PDISS See Thermal Information Operating junction, TJ –40 125 °C Temperature Storage, Tstg –55 150 °C (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) VEN and VVSET absolute maximum rating are VIN + 0.3V or +6.0V, whichever is less. 6.2 ESD Ratings VALUE UNIT Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1) ±2000 V(ESD) Electrostatic discharge V Charged device model (CDM), per JEDEC specification JESD22-C101, all ±500 pins(2) (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 6.3 Recommended Operating Conditions over operating junction temperature range (unless otherwise noted) MIN NOM MAX UNIT VIN Input voltage 2.2 5.5 V VOUT Output voltage 1.8 4.2 V VEN Enable voltage 0 VIN V IOUT Output current 0 150 mA TJ Junction temperature –40 125 °C 6.4 Thermal Information TPS780xx THERMAL METRIC(1) DDC DRV UNIT 5 PINS 6 PINS RθJA Junction-to-ambient thermal resistance 193.0 65.9 RθJC(top) Junction-to-case (top) thermal resistance 40.1 87.3 RθJB Junction-to-board thermal resistance 34.3 35.4 °C/W ψJT Junction-to-top characterization parameter 0.9 1.7 ψJB Junction-to-board characterization parameter 34.1 35.8 RθJC(bot) Junction-to-case (bottom) thermal resistance N/A 6.1 (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. 4 Submit Documentation Feedback Copyright © 2007–2015, Texas Instruments Incorporated Product Folder Links: TPS780 |
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