TPS709

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SBVS186G – MARCH 2012 – REVISED NOVEMBER 2015

6 Specifications

6.1 Absolute Maximum Ratings

(1)

MIN

MAX

UNIT

–0.3

32

Voltage

–0.3

7

V

–0.3

7

Maximum output current

Internally limited

Output short-circuit duration

Indefinite

Continuous total power dissipation

See Thermal Information

–55

150

°C

–55

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

6.2 ESD Ratings

VALUE

UNIT

±2000

Electrostatic discharge

V

±500

(1)

JEDEC document JEP155 states that 2-kV HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 500-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating junction temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

Input voltage

2.7

30

V

Output voltage

1.2

6.5

V

Enable voltage

0

6.5

V

Operating junction temperature

–40

125

°C

6.4 Thermal Information

TPS709

DBV

DRV

UNIT

5 PINS

6 PINS

Junction-to-ambient thermal resistance

212.1

73.1

°C/W

Junction-to-case (top) thermal resistance

78.5

97.0

°C/W

Junction-to-board thermal resistance

39.5

42.6

°C/W

Junction-to-top characterization parameter

2.86

2.9

°C/W

Junction-to-board characterization parameter

38.7

42.9

°C/W

Junction-to-case (bottom) thermal resistance

N/A

12.8

°C/W

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

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