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TPS70925DRVR Datasheet(PDF) 5 Page - Texas Instruments |
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TPS70925DRVR Datasheet(HTML) 5 Page - Texas Instruments |
5 / 34 page TPS709 www.ti.com SBVS186G – MARCH 2012 – REVISED NOVEMBER 2015 6 Specifications 6.1 Absolute Maximum Ratings specified at TJ = –40°C to 125°C (unless otherwise noted); all voltages are with respect to GND (1) MIN MAX UNIT VIN –0.3 32 Voltage VEN –0.3 7 V VOUT –0.3 7 Maximum output current IOUT Internally limited Output short-circuit duration Indefinite Continuous total power dissipation PDISS See Thermal Information Operating junction temperature, TJ –55 150 °C Storage temperature, Tstg –55 150 °C (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. 6.2 ESD Ratings VALUE UNIT Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000 V(ESD) Electrostatic discharge V Charged device model (CDM), per JEDEC specification JESD22-C101(2) ±500 (1) JEDEC document JEP155 states that 2-kV HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 500-V CDM allows safe manufacturing with a standard ESD control process. 6.3 Recommended Operating Conditions over operating junction temperature range (unless otherwise noted) MIN NOM MAX UNIT VIN Input voltage 2.7 30 V VOUT Output voltage 1.2 6.5 V VEN Enable voltage 0 6.5 V TJ Operating junction temperature –40 125 °C 6.4 Thermal Information TPS709 THERMAL METRIC(1) DBV DRV UNIT 5 PINS 6 PINS RθJA Junction-to-ambient thermal resistance 212.1 73.1 °C/W RθJC(top) Junction-to-case (top) thermal resistance 78.5 97.0 °C/W RθJB Junction-to-board thermal resistance 39.5 42.6 °C/W ψJT Junction-to-top characterization parameter 2.86 2.9 °C/W ψJB Junction-to-board characterization parameter 38.7 42.9 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance N/A 12.8 °C/W (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. Copyright © 2012–2015, Texas Instruments Incorporated Submit Documentation Feedback 5 Product Folder Links: TPS709 |
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