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TLV316, TLV2316, TLV4316

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SBOS752A – FEBRUARY 2016 – REVISED SEPTEMBER 2016

Product Folder Links: TLV316 TLV2316 TLV4316

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Copyright © 2016, Texas Instruments Incorporated

(1)

For more information about traditional and new thermal metrics, see Semiconductor and IC Package Thermal Metrics (SPRA953).

7.4 Thermal Information: TLV316

TLV316

UNIT

DBV (SOT-23)

DCK (SC70)

5 PINS

5 PINS

Junction-to-ambient thermal resistance

221.7

263.3

°C/W

Junction-to-case(top) thermal resistance

144.7

75.5

°C/W

Junction-to-board thermal resistance

49.7

51.0

°C/W

Junction-to-top characterization parameter

26.1

1.0

°C/W

Junction-to-board characterization parameter

49.0

50.3

°C/W

Junction-to-case(bottom) thermal resistance

N/A

N/A

°C/W

(1)

For more information about traditional and new thermal metrics, see Semiconductor and IC Package Thermal Metrics (SPRA953).

7.5 Thermal Information: TLV2316

TLV2316

UNIT

D (SOIC)

DGK (VSSOP)

8 PINS

8 PINS

Junction-to-ambient thermal resistance

127.2

186.6

°C/W

Junction-to-case(top) thermal resistance

71.6

78.8

°C/W

Junction-to-board thermal resistance

68.2

107.9

°C/W

Junction-to-top characterization parameter

22.0

15.5

°C/W

Junction-to-board characterization parameter

67.6

106.3

°C/W

Junction-to-case(bottom) thermal resistance

N/A

N/A

°C/W

(1)

For more information about traditional and new thermal metrics, see Semiconductor and IC Package Thermal Metrics (SPRA953).

7.6 Thermal Information: TLV4316

TLV4316

UNIT

PW (TSSOP)

D (SOIC)

14 PINS

14 PINS

Junction-to-ambient thermal resistance

117.2

87.0

°C/W

Junction-to-case(top) thermal resistance

46.2

44.4

°C/W

Junction-to-board thermal resistance

58.9

41.7

°C/W

Junction-to-top characterization parameter

4.9

11.6

°C/W

Junction-to-board characterization parameter

58.3

41.4

°C/W

Junction-to-case(bottom) thermal resistance

N/A

N/A

°C/W