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TLV4316 Datasheet(PDF) 7 Page - Texas Instruments |
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TLV4316 Datasheet(HTML) 7 Page - Texas Instruments |
7 / 37 page 7 TLV316, TLV2316, TLV4316 www.ti.com SBOS752A – FEBRUARY 2016 – REVISED SEPTEMBER 2016 Product Folder Links: TLV316 TLV2316 TLV4316 Submit Documentation Feedback Copyright © 2016, Texas Instruments Incorporated (1) For more information about traditional and new thermal metrics, see Semiconductor and IC Package Thermal Metrics (SPRA953). 7.4 Thermal Information: TLV316 THERMAL METRIC(1) TLV316 UNIT DBV (SOT-23) DCK (SC70) 5 PINS 5 PINS RθJA Junction-to-ambient thermal resistance 221.7 263.3 °C/W RθJC(top) Junction-to-case(top) thermal resistance 144.7 75.5 °C/W RθJB Junction-to-board thermal resistance 49.7 51.0 °C/W ψJT Junction-to-top characterization parameter 26.1 1.0 °C/W ψJB Junction-to-board characterization parameter 49.0 50.3 °C/W RθJC(bot) Junction-to-case(bottom) thermal resistance N/A N/A °C/W (1) For more information about traditional and new thermal metrics, see Semiconductor and IC Package Thermal Metrics (SPRA953). 7.5 Thermal Information: TLV2316 THERMAL METRIC(1) TLV2316 UNIT D (SOIC) DGK (VSSOP) 8 PINS 8 PINS RθJA Junction-to-ambient thermal resistance 127.2 186.6 °C/W RθJC(top) Junction-to-case(top) thermal resistance 71.6 78.8 °C/W RθJB Junction-to-board thermal resistance 68.2 107.9 °C/W ψJT Junction-to-top characterization parameter 22.0 15.5 °C/W ψJB Junction-to-board characterization parameter 67.6 106.3 °C/W RθJC(bot) Junction-to-case(bottom) thermal resistance N/A N/A °C/W (1) For more information about traditional and new thermal metrics, see Semiconductor and IC Package Thermal Metrics (SPRA953). 7.6 Thermal Information: TLV4316 THERMAL METRIC(1) TLV4316 UNIT PW (TSSOP) D (SOIC) 14 PINS 14 PINS RθJA Junction-to-ambient thermal resistance 117.2 87.0 °C/W RθJC(top) Junction-to-case(top) thermal resistance 46.2 44.4 °C/W RθJB Junction-to-board thermal resistance 58.9 41.7 °C/W ψJT Junction-to-top characterization parameter 4.9 11.6 °C/W ψJB Junction-to-board characterization parameter 58.3 41.4 °C/W RθJC(bot) Junction-to-case(bottom) thermal resistance N/A N/A °C/W |
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