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TCA6408A-Q1

SCPS234 – SEPTEMBER 2016

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(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

The input negative-voltage and output voltage ratings may be exceeded if the input and output current ratings are observed.

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted) (see

MIN

MAX

UNIT

–0.5

3.6

V

Supply voltage for P-ports

–0.5

3.6

V

–0.5

3.6

V

–0.5

3.6

V

Input clamp current

ADDR, RESET, SCL

±20

mA

Output clamp current

INT

±20

mA

Input/output clamp current

P-port

±20

mA

SDA

±20

Continuous output low current

P-port

50

mA

Continuous output low current

SDA, INT

25

Continuous output high current

P-port

50

mA

Continuous current through GND

200

mA

160

10

Maximum junction temperature

135

°C

Storage temperature

–65

150

°C

(1)

AEC Q100-002 indicates HBM stressing is done in accordance with the ANSI/ESDA/JEDEC JS-001 specification.

6.2 ESD Ratings

VALUE

UNIT

Electrostatic discharge

±2000

V

Charged-device model (CDM), per AEC Q100-011

±1000

(1)

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

MAX

UNIT

(1)

SCL, SDA, INT

1.65

3.6

V

Supply voltage for P-ports

P-ports, ADDR, RESET

1.65

3.6

V

High-level input voltage

SCL, SDA

V

RESET

3.6

ADDR, P7–P0

3.6

Low-level input voltage

SCL, SDA, RESET

–0.5

V

ADDR, P7–P0

High-level output current

P00-P07

10

mA