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C0-3N0S-10 Datasheet(PDF) 4 Page - Superworld Electronics

Part # C0-3N0S-10
Description  CERAMIC CHIP INDUCTORS
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Manufacturer  SUPERWORLD [Superworld Electronics]
Direct Link  http://www.superworld.com.sg
Logo SUPERWORLD - Superworld Electronics

C0-3N0S-10 Datasheet(HTML) 4 Page - Superworld Electronics

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NOTE : Specifications subject to change without notice. Please check our website for latest information.
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 4
26.01.2015
C0 SERIES
8. SOLDERING AND MOUNTING :
8-1. Recommended PC Board Pattern
L
G
CERAMIC CHIP INDUCTORS
0.20~0.30
GH
Unit:m/m
0.80
L
0.25~0.40
8-2.2 Soldering Iron :
8-2.1 Lead Free Solder Re-flow :
cannot be avoided, the preferred technique is the utilization of hot air soldering tools.
Mildly activated rosin fluxes are preferred. The terminations are suitable for re-flow soldering systems. If hand soldering
Recommended temperature profiles for lead free re-flow soldering in Figure 1. (Refered to J-STD-020C)
Products attachment with a soldering iron is discouraged due to the inherent process control limitations. If a
a) Preheat circuit and products to 150° C.
b) 350° C tip temperature for Ferrite chip bead (max)
c) Never contact the ceramic with the iron tip
soldering iron must be employed the following precautions are recommended. for Iron Soldering in Figure 2.
Note :
8-2. Soldering
e) Use a 20 watt soldering iron with tip diameter of 1.0mm
f) Limit soldering time to 4-5 secs.
d) 1.0mm tip diameter (max)
mechanical stress when warping the board.
PC board should be designed so that products can prevent damage from
Preheating
TP(260° C/40s max.)
60~180s
480s max.
Figure 1. Re-flow Soldering:3 times max
150
25
200
217
Time(sec.)
Within4~5s
Gradual
Cooling
Over 60s.
Figure 2. Wave Soldering:1 times max
cooling
60~150s
20~40s
Soldering
Natural
cooling
150
350
Preheating
Soldering
Natural
Re-flow soldering temperatures below 240 degrees, there will be non-wetting risk
If wave soldering is used ,there will be some risk.
Note.


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