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TPS562209 Datasheet(PDF) 4 Page - Texas Instruments |
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TPS562209 Datasheet(HTML) 4 Page - Texas Instruments |
4 / 28 page TPS562209, TPS563209 SLVSCM5 – SEPTEMBER 2014 www.ti.com 7 Specifications 7.1 Absolute Maximum Ratings TJ = –40°C to 150°C (unless otherwise noted) (1) MIN MAX UNIT VIN, EN –0.3 19 V VBST –0.3 25 V VBST (10 ns transient) –0.3 27.5 V Input voltage range VBST (vs SW) –0.3 6.5 V VFB, –0.3 6.5 V SW –2 19 V SW (10 ns transient) –3.5 21 V Operating junction temperature, TJ –40 150 °C (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. 7.2 Handling Ratings MIN MAX UNIT Tstg Storage temperature range –55 150 °C Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all 2 kV pins(1) V(ESD) Electrostatic discharge Charged device model (CDM), per JEDEC specification JESD22- 500 V C101, all pins(2) (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 7.3 Recommended Operating Conditions TJ = -40°C to 150°C (unless otherwise noted) MIN MAX UNIT VIN Supply input voltage range 4.5 17 V VBST –0.1 23 VBST (10 ns transient) –0.1 26 VBST(vs SW) –0.1 6.0 VI Input voltage range EN –0.1 17 V VFB –0.1 5.5 SW –1.8 17 SW (10 ns transient) –3.5 20 TA Operating free-air temperature –40 85 °C 7.4 Thermal Information TPS562209 TPS563209 THERMAL METRIC(1) UNIT DDC (6 PINS) RθJA Junction-to-ambient thermal resistance 109.2 87.9 RθJC(top) Junction-to-case (top) thermal resistance 44.5 42.2 RθJB Junction-to-board thermal resistance 57.3 13.6 °C/W ψJT Junction-to-top characterization parameter 2.3 1.9 ψJB Junction-to-board characterization parameter 60.4 13.3 (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. 4 Submit Documentation Feedback Copyright © 2014, Texas Instruments Incorporated Product Folder Links: TPS562209 TPS563209 |
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