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TPS65261RHBR Datasheet(PDF) 4 Page - Texas Instruments

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Part # TPS65261RHBR
Description  4.5V to 18V Input Voltage, 3A/2A/2A Output Current Triple Synchronous Step-Down Converter
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Manufacturer  TI1 [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI1 - Texas Instruments

TPS65261RHBR Datasheet(HTML) 4 Page - Texas Instruments

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TPS65261, TPS65261-1
SLVSCD3B – DECEMBER 2013 – REVISED MAY 2014
www.ti.com
Pin Functions (continued)
PIN
DESCRIPTION
NO.
NAME
Boot strapped supply to the high side floating gate driver in buck3. Connect a capacitor (recommend 47nF) from
16
BST3
BST3 pin to LX3 pin.
Soft-start and tracking input for buck3. An internal 5µA pull-up current source is connected to this pin. The soft-start
17
SS3
time can be programmed by connecting a capacitor between this pin and ground.
Error amplifier output and Loop compensation pin for buck3. Connect a series resistor and capacitor to compensate
18
COMP3
the control loop of buck3 with peak current PWM mode.
19
FB3
Feedback Kelvin sensing pin for buck3 output voltage. Connect this pin to buck3 resistor divider.
20
ROSC
Oscillator frequency programmable pin. Connect an external resistor to set the switching frequency.
Analog ground common to buck controllers and other analog circuits. It must be routed separately from high current
21
AGND
power grounds to the (–) terminal of bypass capacitor of input voltage VIN.
22
FB1
Feedback Kelvin sensing pin for buck1 output voltage. Connect this pin to buck1 resistor divider.
Error amplifier output and Loop compensation pin for buck1. Connect a series resistor and capacitor to compensate
23
COMP1
the control loop of buck1 with peak current PWM mode.
Soft-start and tracking input for buck1. An internal 5µA pull-up current source is connected to this pin. The soft-start
24
SS1
time can be programmed by connecting a capacitor between this pin and ground.
Boot strapped supply to the high side floating gate driver in buck1. Connect a capacitor (recommend 47nF) from
25
BST1
BST1 pin to LX1 pin.
Switching node connection to the inductor and bootstrap capacitor for buck1. The voltage swing at this pin is from a
26
LX1
diode voltage below the ground up to PVIN1 voltage.
Power ground connection of Buck1. Connect PGND1 pin as close as practical to the (–) terminal of VIN1 input
27
PGND1
ceramic capacitor.
Input power supply for buck1. Connect PVIN1 pin as close as practical to the (+) terminal of an input ceramic
28
PVIN1
capacitor (suggest 10µF).
29
VIN
Buck controller power supply.
30
VDIV
Input voltage threshold for power failure detection of input voltage.
Enable for buck1. Float to enable. Can use this pin to adjust the input under-voltage lockout of buck1 with a resistor
31
EN1
divider.
Enable for buck2. Float to enable. Can use this pin to adjust the input under-voltage lockout of buck2 with a resistor
32
EN2
divider.
There is no electric signal down bonded to thermal pad inside IC. Exposed thermal pad must be soldered to PCB for
PAD
optimal thermal performance.
7 Specifications
7.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)
(1)
MIN
MAX
UNIT
PVIN1, PVIN2, PVIN3,VIN
–0.3
20
V
LX1, LX2, LX3 (Maximum withstand voltage transient < 20 ns)
–1.0
20
V
BST1, BST2, BST3 referenced to LX1, LX2, LX3 pins respectively
–0.3
7
V
EN1, EN2, EN3, PGOOD, V7V, MODE, RESET, VDIV
–0.3
7
V
FB1, FB2, FB3, COMP1 , COMP2, COMP3, SS1, SS2, SS3, ROSC
–0.3
3.6
V
AGND, PGND1, PGND2, PGND3
–0.3
0.3
V
Operating junction temperature, TJ
–40
125
°C
(1)
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
4
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