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TPS65261RHBR Datasheet(PDF) 4 Page - Texas Instruments |
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TPS65261RHBR Datasheet(HTML) 4 Page - Texas Instruments |
4 / 44 page TPS65261, TPS65261-1 SLVSCD3B – DECEMBER 2013 – REVISED MAY 2014 www.ti.com Pin Functions (continued) PIN DESCRIPTION NO. NAME Boot strapped supply to the high side floating gate driver in buck3. Connect a capacitor (recommend 47nF) from 16 BST3 BST3 pin to LX3 pin. Soft-start and tracking input for buck3. An internal 5µA pull-up current source is connected to this pin. The soft-start 17 SS3 time can be programmed by connecting a capacitor between this pin and ground. Error amplifier output and Loop compensation pin for buck3. Connect a series resistor and capacitor to compensate 18 COMP3 the control loop of buck3 with peak current PWM mode. 19 FB3 Feedback Kelvin sensing pin for buck3 output voltage. Connect this pin to buck3 resistor divider. 20 ROSC Oscillator frequency programmable pin. Connect an external resistor to set the switching frequency. Analog ground common to buck controllers and other analog circuits. It must be routed separately from high current 21 AGND power grounds to the (–) terminal of bypass capacitor of input voltage VIN. 22 FB1 Feedback Kelvin sensing pin for buck1 output voltage. Connect this pin to buck1 resistor divider. Error amplifier output and Loop compensation pin for buck1. Connect a series resistor and capacitor to compensate 23 COMP1 the control loop of buck1 with peak current PWM mode. Soft-start and tracking input for buck1. An internal 5µA pull-up current source is connected to this pin. The soft-start 24 SS1 time can be programmed by connecting a capacitor between this pin and ground. Boot strapped supply to the high side floating gate driver in buck1. Connect a capacitor (recommend 47nF) from 25 BST1 BST1 pin to LX1 pin. Switching node connection to the inductor and bootstrap capacitor for buck1. The voltage swing at this pin is from a 26 LX1 diode voltage below the ground up to PVIN1 voltage. Power ground connection of Buck1. Connect PGND1 pin as close as practical to the (–) terminal of VIN1 input 27 PGND1 ceramic capacitor. Input power supply for buck1. Connect PVIN1 pin as close as practical to the (+) terminal of an input ceramic 28 PVIN1 capacitor (suggest 10µF). 29 VIN Buck controller power supply. 30 VDIV Input voltage threshold for power failure detection of input voltage. Enable for buck1. Float to enable. Can use this pin to adjust the input under-voltage lockout of buck1 with a resistor 31 EN1 divider. Enable for buck2. Float to enable. Can use this pin to adjust the input under-voltage lockout of buck2 with a resistor 32 EN2 divider. There is no electric signal down bonded to thermal pad inside IC. Exposed thermal pad must be soldered to PCB for PAD optimal thermal performance. 7 Specifications 7.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) MIN MAX UNIT PVIN1, PVIN2, PVIN3,VIN –0.3 20 V LX1, LX2, LX3 (Maximum withstand voltage transient < 20 ns) –1.0 20 V BST1, BST2, BST3 referenced to LX1, LX2, LX3 pins respectively –0.3 7 V EN1, EN2, EN3, PGOOD, V7V, MODE, RESET, VDIV –0.3 7 V FB1, FB2, FB3, COMP1 , COMP2, COMP3, SS1, SS2, SS3, ROSC –0.3 3.6 V AGND, PGND1, PGND2, PGND3 –0.3 0.3 V Operating junction temperature, TJ –40 125 °C (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. 4 Submit Documentation Feedback Copyright © 2013–2014, Texas Instruments Incorporated |
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