NIS5132 Series

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11

PACKAGE DIMENSIONS

DFN10, 3x3, 0.5P

CASE 485C

ISSUE C

10X

SEATING

PLANE

L

D

E

0.15 C

A

A1

e

D2

E2

b

15

10

6

NOTES:

1. DIMENSIONING AND TOLERANCING PER

ASME Y14.5M, 1994.

2. CONTROLLING DIMENSION: MILLIMETERS.

3. DIMENSION b APPLIES TO PLATED

TERMINAL AND IS MEASURED BETWEEN

0.25 AND 0.30 MM FROM TERMINAL.

4. COPLANARITY APPLIES TO THE EXPOSED

PAD AS WELL AS THE TERMINALS.

5. TERMINAL b MAY HAVE MOLD COMPOUND

MATERIAL ALONG SIDE EDGE. MOLD

FLASHING MAY NOT EXCEED 30 MICRONS

ONTO BOTTOM SURFACE OF TERMINAL b.

6. DETAILS A AND B SHOW OPTIONAL VIEWS

FOR END OF TERMINAL LEAD AT EDGE OF

PACKAGE.

7. FOR DEVICE OPN CONTAINING W OPTION,

DETAIL B ALTERNATE CONSTRUCTION IS

NOT APPLICABLE.

B

A

0.15 C

TOP VIEW

SIDE VIEW

BOTTOM VIEW

PIN 1

REFERENCE

0.10 C

0.08 C

(A3)

C

10X

10X

0.10 C

0.05 C

A B

NOTE 3

K

10X

DIM MIN

MAX

MILLIMETERS

A

0.80

1.00

A1

0.00

0.05

A3

0.20 REF

b

0.18

0.30

D

3.00 BSC

D2

2.40

2.60

E

3.00 BSC

E2

1.70

1.90

e

0.50 BSC

L

0.35

0.45

L1

0.00

0.03

DETAIL A

K

0.19 TYP

2X

2X

L1

DETAIL A

Bottom View

(Optional)

A1

A3

DETAIL B

Side View

(Optional)

EDGE OF PACKAGE

MOLD CMPD

EXPOSED Cu

DETAIL B

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

SOLDERING FOOTPRINT*

2.1746

2.6016

1.8508

0.5000 PITCH

0.5651

10X

3.3048

0.3008

10X

DIMENSIONS: MILLIMETERS

ON Semiconductor and the

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NIS5132/D

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