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LV5236VZ-TLM-H Datasheet(PDF) 4 Page - ON Semiconductor |
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LV5236VZ-TLM-H Datasheet(HTML) 4 Page - ON Semiconductor |
4 / 36 page LV5236V No.A1943-4/36 SOLDERING FOOTPRINT* *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. (Unit: mm) 0.32 0.65 (7.8) NOTES: 1. The measurements are for reference only, and unable to guarantee. 2. Please take appropriate action to design the actual Exposed Die Pad and Fin portion. 3. After setting, verification on the product must be done. (Although there are no recommended design for Exposed Die Pad and Fin portion Metal mask and shape for Through−Hole pitch (Pitch & Via etc), checking the soldered joint condition and reliability verification of soldered joint will be needed. Void gradient insufficient thickness of soldered joint or bond degradation could lead IC destruction because thermal conduction to substrate becomes poor.) XXXXX = Specific Device Code Y = Year M = Month DDD = Additional Traceability Data GENERIC MARKING DIAGRAM* XXXXXXXXXX YMDDD |
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