LV5236V

No.A1943-4/36

SOLDERING FOOTPRINT*

*For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor

Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.

(Unit: mm)

0.32

0.65

(7.8)

NOTES:

1. The measurements are for reference only, and unable to guarantee.

2. Please take appropriate action to design the actual Exposed Die Pad and Fin portion.

3. After setting, verification on the product must be done.

(Although there are no recommended design for Exposed Die Pad and Fin portion Metal mask and shape

for Through−Hole pitch (Pitch & Via etc), checking the soldered joint condition and reliability verification of

soldered joint will be needed. Void gradient insufficient thickness of soldered joint or bond degradation

could lead IC destruction because thermal conduction to substrate becomes poor.)

XXXXX = Specific Device Code

Y = Year

M = Month

DDD = Additional Traceability Data

GENERIC

MARKING DIAGRAM*

XXXXXXXXXX

YMDDD