74AUP1G58

Document number: DS36853 Rev. 1 - 2

7 of 16

www.diodes.com

June 2015

© Diodes Incorporated

74AUP1G58

Package Characteristics

Symbol

Parameter

Package

Test Conditions

Min

Typ.

Max

Unit

Thermal Resistance Junction-

to-Ambient

SOT26

(Note 9)

-

166

-

°C/W

SOT363

-

371

-

X2-DFN0910-6

-

450

-

X2-DFN1010-6

-

445

-

X2-DFN1410-6

-

430

-

Thermal Resistance Junction-

to-Case

SOT26

(Note 9)

-

46

-

°C/W

SOT363

-

143

-

X2-DFN0910-6

-

255

-

X2-DFN1010-6

-

250

-

X2-DFN1410-6

-

190

-

Note:

9. Test condition for each of the 8 package types: Device mounted on FR-4 substrate PC board, 2oz copper, with minimum recommended pad layout.

Parameter

Test

Conditions

Vcc

TYP

Unit

Power

Dissipation

Capacitance

f = 1MHz

No Load

0.8 V

4

pF

1.2V ± 0.1V

4

1.5V ± 0.1V

4

1.8V ± 0.15V

4

2.5V ± 0.2V

4.4

3.3 ± 0.3V

4.8

Input

Capacitance

0 V or 3.3V

1.1

pF

Output

Capacitance

0 V

2.0

pF

Switching Characteristics

Parameter

From

Input

TO

OUTPUT

Unit

Min

TYP

Max

Min

Max

Min

Max

A,

B,

or

C

Y

0.8 V

-

28

-

-

-

-

-

ns

1.2 V ± 0.1 V

2.8

7.5

14.7

2.3

14.9

2.3

15.2

1.5 V ± 0.1 V

2.1

4.8

7.7

1.6

8.3

1.6

8.6

1.8 V ± 0.15 V

1.5

4

6.3

1

7

1

7.3

2.5 V ± 0.2 V

1.1

3.2

4.6

0.6

5.2

0.6

5.4

3.3 V ± 0.3 V

1

2.9

4

0.5

4.2

0.5

4.4