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NCP81071BZR2G Datasheet(PDF) 1 Page - ON Semiconductor

Part # NCP81071BZR2G
Description  Dual 5 A High Speed Low-Side MOSFET Drivers
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Manufacturer  ONSEMI [ON Semiconductor]
Direct Link  http://www.onsemi.com
Logo ONSEMI - ON Semiconductor

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© Semiconductor Components Industries, LLC, 2016
April, 2016 − Rev. 3
1
Publication Order Number:
NCP81071/D
NCP81071
Dual 5 A High Speed
Low-Side MOSFET Drivers
with Enable
NCP81071 is a high speed dual low−side MOSFETs driver. It is
capable of providing large peak currents into capacitive loads. This
driver can deliver 5 A peak current at the Miller plateau region to help
reduce the Miller effect during MOSFETs switching transition. This
driver also provides enable functions to give users better control
capability in different applications. ENA and ENB are implemented
on pin 1 and pin 8 which were previously unused in the industry
standard pin−out. They are internally pulled up to driver’s input
voltage for active high logic and can be left open for standard
operations. This part is available in MSOP8−EP package
, SOIC8
package and WDFN8 3 mm x 3 mm package
.
Features
High Current Drive Capability ±5 A
TTL/CMOS Compatible Inputs Independent of Supply Voltage
Industry Standard Pin−out
High Reverse Current Capability (6 A) Peak
Enable Functions for Each Driver
8 ns Typical Rise and 8 ns Typical Fall Times with 1.8 nF Load
Typical Propagation Delay Times of 20 ns with Input Falling and
2
0 ns with Input Rising
Input Voltage from 4.5 V to 20 V
Dual Outputs can be Paralleled for Higher Drive Current
These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
Applications
Server Power
Telecommunication, Datacenter Power
Synchronous Rectifier
Switch Mode Power Supply
DC/DC Converter
Power Factor Correction
Motor Drive
Renewable Energy, Solar Inverter
See detailed ordering and shipping information in the package
dimensions section on page 11 of this data sheet.
ORDERING INFORMATION
MARKING
DIAGRAMS
www.onsemi.com
SOIC−8
D SUFFIX
CASE 751
XXXX
ALYW
G
1
8
PIN CONNECTIONS
INA
ENA
1
8
(Top View)
XX = Specific Device Code
A
= Assembly Location
L
= Wafer Lot
Y
= Year
W
= Work Week
M
= Date Code
G
= Pb−Free Package
(Note: Microdot may be in either location)
OUTB
VDD
OUTA
ENB
INB
GND
MSOP−8
Z SUFFIX
CASE 846AM
WDFN8
MN SUFFIX
CASE 511CD
XXXX
AYW
G
XX M
G
G
1
1


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