NCP81063

www.onsemi.com

8

PACKAGE DIMENSIONS

DFN8 3x3, 0.5P

CASE 506BJ

ISSUE O

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

SOLDERMASK DEFINED

PIN 1

REFERENCE

A

B

C

0.10

2X

2X

TOP VIEW

D

E

C

0.10

NOTES:

1. DIMENSIONS AND TOLERANCING PER ASME

Y14.5M, 1994.

2. CONTROLLING DIMENSION: MILLIMETERS.

3. DIMENSION b APPLIES TO PLATED TERMINAL

AND IS MEASURED BETWEEN 0.15 AND 0.30

MM FROM TERMINAL.

4. COPLANARITY APPLIES TO THE EXPOSED

PAD AS WELL AS THE TERMINALS.

E2

BOTTOM VIEW

b

0.10

8X

L

14

0.05

C AB

C

D2

e

K

85

8X

8X

(A3)

C

C

0.05

8X

C

0.05

SIDE VIEW

A1

A

SEATING

PLANE

DIM

MIN

MAX

MILLIMETERS

A

0.80

1.00

A1

0.00

0.05

A3

0.20 REF

b

0.18

0.30

D

3.00 BSC

D2

1.64

1.84

E

3.00 BSC

E2

1.35

1.55

e

0.50 BSC

K

0.20

−−−

L

0.30

0.50

NOTE 3

L

DETAIL A

OPTIONAL

CONSTRUCTION

L1

DETAIL A

DETAIL B

EDGE OF PACKAGE

MOLD CMPD

EXPOSED Cu

L

OPTIONAL

CONSTRUCTION

OPTIONAL

CONSTRUCTION

L1

0.00

0.03

NOTE 4

DETAIL B

3.30

8X

DIMENSION: MILLIMETERS

0.63

1.55

1.85

0.50

PITCH

8X

0.35

MOUNTING FOOTPRINT

DETAIL A

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