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48-22-739-60-00 Datasheet(PDF) 8 Page - 3M Electronics |
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48-22-739-60-00 Datasheet(HTML) 8 Page - 3M Electronics |
8 / 12 page 8 3M EMI/EMC Solutions 3M™ Electrically Conductive Adhesive Transfer Tapes 3M™ Electrically Conductive Adhesive Transfer Tapes are designed to help you save time in a variety of specialized electronics assembly operations – from attaching EMI shields and gaskets to grounding and bonding flexible circuits and PCBs – while improving the performance and reliability of your finished products. 3M ECATT General Overview Comparative Reference Table ECATT Basic Comparative Reference Table: Based on the suggested “ECATT Selection Process”, the end user should identify 2-4 ECATT products to test in an application to determine fitness for use. As each application is unique, it is difficult to identify the “Optimum” ECATT product without testing the ECATT products in an end use assembly design. The ECATT Selection Process of “Good-Better-Best” ranks products as they might perform in a nominal application. As each ECATT may employ different conductive particles, scrim or non-woven, thickness variations, acrylic adhesive type, etc., they will perform differently based on end use application – hence the need for the end users’ own comparative testing. The following technical information and data should be considered representative or typical and should not be used for specification purposes. Contact Resistance (R ohms) between a Copper foil test panel and a 2nd Sheet of a Copper foil test panel using the 3M ECATT Contact Resistance (R ohms) between a Gold Flexible Test Strip and a Gold Pad PCB panel using the 3M ECATT Adhesive Type Features, Advantages, and Benefits Copper foil bonded to a Copper Foil using the 3M ECATT / 3M 2-point Resistance Test Method / 645 mm2 Overlap Contact Area / 1 hour RT Dwell. See note 1. Gold flex bonded to PCB gold test pad. 6 mm2 overlap contact area. 1 hour RT Dwell. See note 1. 9703 50 Z Silver Low Outgassing Acrylic ECATT Z- Axis, Low outgassing < 0.2 < 0.2 9704 50 Z Silver Low Outgassing Acrylic ECATT Z-axis, High adhesion, Low outgassing < 0.2 < 0.2 9705 50 Z Silver Standard Acrylic ECATT Z-Axis, Standard outgassing version of 9703 < 0.2 < 0.2 9706 50 Z Silver High Adhesion Acrylic ECATT High adhesion version of the 9705 < 0.2 < 0.3 9707 9707 50 XYZ Silver High Adhesion Acrylic ECATT High adhesion, “Bond Line Gap/Slit” EMI shielding for High Frequency, Low contact R to SS < 0.2 < 0.3 9709 50 XYZ Silver Standard Acrylic ECATT Standard adhesion, “Bond Line Gap/Slit” EMI shielding for High Frequency < 0.2 < 0.3 9709S 50 XYZ Silver Standard Acrylic ECATT Standard adhesion, “Bond Line Gap/Slit” EMI shielding for High Frequency, Low contact R to SS < 0.2 < 0.2 9709SL 50 XYZ Silver Standard Acrylic ECATT Premium low liner release version of 9709S < 0.2 < 0.2 7805 150 XYZ Silver Standard Acrylic ECATT Thicker ECATT for gap filling < 1.0 < 0.2 7850 150 XYZ Carbon High Adhesion Acrylic ECATT Higher thermal conductivity & Thicker ECATT for gap filling < 1.0 < 10.0 7772 66 XYZ Nickle & Alum DC Medium Adhesion Acrylic D/C Double coated aluminum foil < 0.5 < 2.0 9712 125 XYZ Carbon Standard Acrylic ECATT Non-woven conductive scrim & Standard acrylic adhesive < 1.5 < 15.0 9713 89 XYZ Nickel/C Standard Acrylic ECATT Lower R non-woven conductive scrim vs. 9712 & Standard acrylic adhesive < 0.4 < 7.5 9719 100 XYZ Nickel/C Silicone ECATT Low surface energy silicone adhesive, Higher temperature resistance, Lower R non-woven conductive scrim vs. 9712 < 1.0 < 20.0 9720S 30 XYZ Nickel/Cu High Adhesion Acrylic ECATT Lower R non-woven conductive scrim vs. 9713, Thinner scrim design & Medium adhesion < 0.2 < 0.5 9723 60 XYZ Nickel/Cu High Adhesion Acrylic ECATT Lower R non-woven conductive scrim vs. 9713, Thinner scrim design & High adhesion < 0.2 < 0.4 9750 50 XYZ Nickel/Cu High Adhesion Acrylic ECATT Lower R non-woven conductive scrim vs. 9713 & High adhesion < 0.2 < 0.5 9732 100 XYZ Nickel/Cu Medium Adhesion Acrylic ECATT Lower R non-woven conductive scrim vs. 9713, Thicker scrim design & High adhesion < 0.2 < 2.5 9760 50 XYZ Nickel/Cu High / Low Adhesion Double sided reworkable Acrylic ECATT Easier rework as greater Face Side to Back Side adhesion delta. Easier rework version of 9725. High and Low adhesion sides. < 0.2 < 0.8 9764 150 XYZ Nickel/Cu High / Low Adhesion Double sided reworkable Acrylic ECATT Easier rework as greater Face Side to Back Side adhesion delta. Easier rework and thicker version of 9732. High and Low adhesion sides. < 0.5 < 5.0 9780 200 XYZ Nickel/Cu High / Low Adhesion Double sided reworkable Acrylic ECATT Easier rework as greater Face Side to Back Side adhesion delta. Easier rework and thicker version of 9732. High and Low adhesion sides. < 0.5 < 5.0 Note 1: Test & performance results will vary based on items such as, but are not limited to: Contact area; Assembly method; Testing conditions; Normal variations in product performance from one mfg. lot to a different mfg. lot of material – along with the normal variations found in a material within a mfg. lot (i.e., thickness, available conductive material in an actual sample tested, variations in conductive filler materials and uniformity of conductive materials dispersed within a lot of material, variations in adhesives, etc.); Test methods; Environmental aging; Exact test surface material type utilized, etc. The “Copper to Copper” & “Gold Flex to PCB” testing also should be noted for the differences related to the “Contact area” difference in the Test Methods (645 mm2 vs. 6 mm2) as this does impact the test results. Testing of ECATT materials and the noted test substrates does not imply that the ECATT is suitable for an end use application of similar materials. End user is responsible to determine if an ECATT and substrate combination is fit for use in their intended end use application. Note 2: More ECATT options are available. Chart references typical type options. Contact your 3M Technical Service Representative for more details. |
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