MDC3105

http://onsemi.com

2

INTERNAL CIRCUIT DIAGRAMS

CASE 318F

CASE 318

(3)

(1)

1.0 k

33 k

6.6 V

GND

(2)

(6)

(5)

1.0 k

33 k

6.6 V

GND

(1)

(3)

(2)

1.0 k

33 k

6.6 V

GND

(4)

CASE 463A

(1, 2, 5, 6)

(3)

1.0 k

33 k

6.6 V

GND

(4)

Rating

Symbol

Value

Unit

Power Supply Voltage

6.0

Vdc

Input Voltage

6.0

Vdc

Reverse Input Voltage

−0.5

Vdc

Repetitive Pulse Zener Energy Limit (Duty Cycle ≤ 0.01%)

SOT−23

Ezpk

50

mJ

Output Sink Current − Continuous

500

mA

Junction Temperature

150

°C

Operating Ambient Temperature Range

−40 to +85

°C

Storage Temperature Range

−65 to +150

°C

Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the

Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect

device reliability.

THERMAL CHARACTERISTICS

Rating

Symbol

Value

Unit

Total Device Power Dissipation (Note 1)

SOT−23

Derate above 25°C

225

1.8

mW

mW/°C

Total Device Power Dissipation (Note 1)

SC−74

Derate above 25°C

380

1.5

mW

mW/°C

Total Device Power Dissipation (Note 1)

SOT−563

Derate above 25°C

357

2.9

mW

mW/°C

Thermal Resistance Junction−to−Ambient

SOT−23

SC−74

SOT−563

556

329

250

°C/W