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PCA9848PWJ Datasheet(PDF) 11 Page - NXP Semiconductors

Part # PCA9848PWJ
Description  8-channel ultra-low voltage, Fm I2C-bus switch with reset
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Manufacturer  NXP [NXP Semiconductors]
Direct Link  http://www.nxp.com
Logo NXP - NXP Semiconductors

PCA9848PWJ Datasheet(HTML) 11 Page - NXP Semiconductors

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PCA9848
All information provided in this document is subject to legal disclaimers.
© NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet
Rev. 1 — 15 December 2014
11 of 32
NXP Semiconductors
PCA9848
8-channel ultra-low voltage, Fm+ I2C-bus switch with reset
6.6 Power-on reset requirements
In the event of a glitch or data corruption, PCA9848 can be reset to its default conditions
by using the power-on reset feature. Power-on reset requires that the device go through a
power cycle to be completely reset. This reset also happens when the device is
powered on for the first time in an application.
Power-on reset is shown in Figure 11.
Table 6 specifies the performance of the power-on reset feature for PCA9848 for both
types of power-on reset.
[1]
Level that VDD2 can glitch down to with a ramp rate = 0.4 s/V, but not cause a functional disruption when tw(gl)VDD <1 s.
[2]
Glitch width that will not cause a functional disruption when
V
DD(gl) =0.5  VDD2.
Glitches in the power supply can also affect the power-on reset performance of this
device. The glitch width (tw(gl)VDD) and glitch height (VDD(gl)) are dependent on each
other. The bypass capacitance, source impedance, and device impedance are factors that
affect power-on reset performance. Figure 12 and Table 6 provide more information on
how to measure these specifications.
Fig 11. VDD2 is lowered below the POR threshold, then ramped back up to VDD2
aaa-014361
VDD2
time
ramp-down
(dV/dt)f
ramp-up
(dV/dt)r
time to re-ramp
when VDD2 drops
to VPOR(min) − 50 mV or
below 0.2 V to VSS
td(rst)
VI drops below POR levels
Table 6.
Recommended supply sequencing and ramp rates
Tamb =25 C (unless otherwise noted). Not tested; specified by design.
Symbol
Parameter
Condition
Min
Typ
Max
Unit
(dV/dt)f
fall rate of change of voltage
Figure 11
0.1
-
2000
ms
(dV/dt)r
rise rate of change of voltage
Figure 11
0.1
-
2000
ms
td(rst)
reset delay time
Figure 11; re-ramp time when VDD2
drops to VPOR(min)  50 mV) or below
0.2 V to VSS
1-
-
s
V
DD(gl)
glitch supply voltage difference
Figure 12
[1] --
1.0
V
tw(gl)VDD
supply voltage glitch pulse width
Figure 12
[2] --
10
s
VPOR(trip)
power-on reset trip voltage
falling VDD2
0.7
-
-
V
rising VDD2
--
1.5
V


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