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TPA751DGN Datasheet(PDF) 1 Page - Texas Instruments |
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TPA751DGN Datasheet(HTML) 1 Page - Texas Instruments |
1 / 23 page TPA751 700-mW MONO LOW-VOLTAGE AUDIO POWER AMPLIFIER WITH DIFFERENTIAL INPUTS SLOS336C – DECEMBER 2000 – REVISED OCTOBER 2002 1 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 D Fully Specified for 3.3-V and 5-V Operation D Wide Power Supply Compatibility 2.5 V – 5.5 V D Power Supply Rejection at 217 Hz – 84 dB at VDD = 5 V – 81 dB at VDD = 3.3 V D Output Power for RL = 8 Ω – 700 mW at VDD = 5 V – 250 mW at VDD = 3.3 V D Ultralow Supply Current in Shutdown Mode . . . 1.5 nA D Thermal and Short-Circuit Protection D Surface-Mount Packaging – SOIC – PowerPAD MSOP – MicroStar Junior (BGA) description The TPA751 is a bridge-tied load (BTL) audio power amplifier developed especially for low-voltage applications where internal speakers are required. Operating with a 3.3-V supply, the TPA751 can deliver 250-mW of continuous power into a BTL 8- Ω load at less than 0.6% THD+N throughout voice band frequencies. Although this device is characterized out to 20 kHz, its operation is optimized for narrower band applications such as wireless communications. The BTL configuration eliminates the need for external coupling capacitors on the output in most applications, which is particularly important for small battery-powered equipment. This device features a shutdown mode for power-sensitive applications with a supply current of 1.5 nA during shutdown. The TPA751 is available in a 3.0 × 3.0 mm MicroStar Junior (BGA), 8-pin SOIC surface-mount package and a surface-mount PowerPAD MSOP. Audio Input Bias Control VDD 700 mW 6 5 7 VO+ VDD 1 2 4 BYPASS IN – VDD/2 CI RI CS CB RF SHUTDOWN VO–8 GND From System Control 3 IN+ – + – + Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. Copyright 2002, Texas Instruments Incorporated PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. 1 2 3 4 8 7 6 5 SHUTDOWN BYPASS IN+ IN– VO– GND VDD VO+ D OR DGN PACKAGE (TOP VIEW) (SIDE VIEW) MicroStar Junior t (GQS) Package (TOP VIEW) SHUTDOWN VO– BYPASS IN+ IN– GND VDD VO+ NOTE: The shaded terminals are used for thermal connections to the ground plane. (E2) (E3) (E4) (E5) (A2) (A3) (A4) (A5) PowerPAD and MicroStar Junior are trademarks of Texas Instruments. |
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