NCV8605, NCV8606

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10

current and to minimize noise contribution to the output

Thermal

As power in the NCV8605/NCV8606 increases, it might

become necessary to provide some thermal relief. The

maximum power dissipation supported by the device is

dependent upon board design and layout. Mounting pad

configuration on the PCB, the board material, and the

ambient temperature affect the rate of junction temperature

rise for the part. When the NCV8605/NCV8606 has good

thermal conductivity through the PCB, the junction

temperature will be relatively low with high power

applications.

The

maximum

dissipation

the

NCV8605/NCV8606 can handle is given by:

(eq. 3)

copper area, FR4 can dissipate up to 1.3 W when the ambient

PCB area.

The power dissipated by the NCV8605/NCV8606 can be

calculated from the following equations:

(eq. 4)

or

(eq. 5)

0

50

100

150

200

250

0

200

400

600

800

Figure 23. Thermal Resistance vs. Copper Area

FR4 = 1.0 oz

FR4 = 2.0 oz

Hints

wide as possible. When the impedance of these traces is

high, there is a chance to pick up noise or cause the regulator

to malfunction. Place external components, especially the

output capacitor, as close as possible to the

NCV8605/NCV8606, and make traces as short as possible.