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SN74LVC1G10DBVR Datasheet(PDF) 1 Page - Texas Instruments |
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SN74LVC1G10DBVR Datasheet(HTML) 1 Page - Texas Instruments |
1 / 11 page SN74LVC1G10 SINGLE 3INPUT POSITIVENAND GATE SCES486B − SEPTEMBER 2003 − REVISED FEBRUARY 2004 1 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 D Available in the Texas Instruments NanoStar and NanoFree Packages D Supports 5-V VCC Operation D Inputs Accept Voltages to 5.5 V D Max tpd of 3.8 ns at 3.3 V D Low Power Consumption, 10-µA Max ICC D ±24-mA Output Drive at 3.3 V D Ioff Supports Partial-Power-Down Mode Operation D Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II D ESD Protection Exceeds JESD 22 − 2000-V Human-Body Model (A114-A) − 200-V Machine Model (A115-A) − 1000-V Charged-Device Model (C101) description/ordering information The SN74LVC1G10 performs the Boolean function Y = A • B • C or Y = A + B + C in positive logic. NanoStar and NanoFree package technology is a major breakthrough in IC packaging concepts, using the die as the package. This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down. ORDERING INFORMATION TA PACKAGE† ORDERABLE PART NUMBER TOP-SIDE MARKING‡ NanoStar − WCSP (DSBGA) 0.23-mm Large Bump − YEP Tape and reel SN74LVC1G10YEPR _ _ _C2_ −40 °C to 85°C NanoFree − WCSP (DSBGA) 0.23-mm Large Bump − YZP (Pb-free) Tape and reel SN74LVC1G10YZPR _ _ _C2_ SOT (SOT-23) − DBV Tape and reel SN74LVC1G10DBVR C10_ SOT (SC-70) − DCK Tape and reel SN74LVC1G10DCKR C2_ † Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. ‡ DBV/DCK: The actual top-side marking has one additional character that designates the assembly/test site. YEP/YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free). Copyright 2004, Texas Instruments Incorporated NanoStar and NanoFree are trademarks of Texas Instruments. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. DBV OR DCK PACKAGE (TOP VIEW) 1 2 3 6 5 4 A GND B C VCC Y 3 2 1 4 5 6 B GND A Y VCC C YEP OR YZP PACKAGE (BOTTOM VIEW) PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. |
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