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SI8402DB Datasheet(PDF) 6 Page - Vishay Siliconix |
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SI8402DB Datasheet(HTML) 6 Page - Vishay Siliconix |
6 / 6 page Si8402DB Vishay Siliconix New Product www.vishay.com 6 Document Number: 72657 S-32557—Rev. A, 15-Dec-03 PACKAGE OUTLINE MICRO FOOT: 4-BUMP (2 X 2, 0.8-mm PITCH) NOTES (Unless Otherwise Specified): 5. Laser mark on the silicon die back, coated with a thin metal. 6. Bumps are Eutectic solder 63/57 Sn/Pb. 7. Non-solder mask defined copper landing pad. 8. The flat side of wafers is oriented at the bottom. Bump Note 2 8402 XXX Recommended Land Mark on Backside of Die Silicon 4 O 0.30 X 0.31 Note 3 Solder Mask O X 0.40 b Diamerter e e A A2 A1 e S D e S E MILLIMETERS* INCHES Dim Min Max Min Max A 0.600 0.650 0.0236 0.0256 A1 0.260 0.290 0.0102 0.0114 A2 0.340 0.360 0.0134 0.0142 b 0.370 0.410 0.0146 0.0161 D 1.520 1.600 0.0598 0.0630 E 1.520 1.600 0.0598 0.0630 e 0.750 0.850 0.0295 0.0335 S 0.370 0.380 0.0146 0.0150 * Use millimeters as the primary measurement. |
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