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SAF7118 Datasheet(PDF) 2 Page - NXP Semiconductors

Part No. SAF7118
Description  Multistandard video decoder with adaptive comb filter and component video input
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Maker  PHILIPS [NXP Semiconductors]
Homepage  http://www.nxp.com
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 2 page
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2004 Jul 22
2
Philips Semiconductors
Product specification
Multistandard video decoder with adaptive
comb filter and component video input
SAF7118
CONTENTS
1
FEATURES
1.1
Video acquisition/clock
1.2
Video decoder
1.3
Component video processing
1.4
Video scaler
1.5
Vertical Blanking Interval (VBI) data decoder
and slicer
1.6
Audio clock generation
1.7
Digital I/O interfaces
1.8
Miscellaneous
2
APPLICATIONS
3
GENERAL DESCRIPTION
4
QUICK REFERENCE DATA
5
ORDERING INFORMATION
6
BLOCK DIAGRAM
7
PINNING
8
FUNCTIONAL DESCRIPTION
8.1
Decoder
8.2
Component video processing
8.3
Decoder output formatter
8.4
Scaler
8.5
VBI data decoder and capture
(subaddresses 40H to 7FH)
8.6
Image port output formatter
(subaddresses 84H to 87H)
8.7
Audio clock generation
(subaddresses 30H to 3FH)
9
INPUT/OUTPUT INTERFACES AND PORTS
9.1
Analog terminals
9.2
Audio clock signals
9.3
Clock and real-time synchronization signals
9.4
Interrupt handling
9.5
Video expansion port (X port)
9.6
Image port (I port)
9.7
Host port for 16-bit extension of video data I/O
(H port)
9.8
Basic input and output timing diagrams I port
and X port
10
BOUNDARY SCAN TEST
10.1
Initialization of boundary scan circuit
10.2
Device identification codes
11
LIMITING VALUES
12
THERMAL CHARACTERISTICS
13
CHARACTERISTICS
14
APPLICATION INFORMATION
15
I2C-BUS DESCRIPTION
15.1
I2C-bus format
15.2
I2C-bus details
15.3
Programming register RGB/Y-PB-PR
component input processing
15.4
Interrupt mask registers
15.5
Programming register audio clock generation
15.6
Programming register VBI data slicer
15.7
Programming register interfaces and scaler
part
16
PROGRAMMING START SET-UP
16.1
Decoder part
16.2
Component video part and interrupt mask
16.3
Audio clock generation part
16.4
Data slicer and data type control part
16.5
Scaler and interfaces
17
PACKAGE OUTLINES
18
SOLDERING
18.1
Introduction to soldering surface mount
packages
18.2
Reflow soldering
18.3
Wave soldering
18.4
Manual soldering
18.5
Suitability of surface mount IC packages for
wave and reflow soldering methods
19
DATA SHEET STATUS
20
DEFINITIONS
21
DISCLAIMERS
22
PURCHASE OF PHILIPS I2C COMPONENTS




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