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NCP1411DMR2G Datasheet(PDF) 2 Page - ON Semiconductor

Part # NCP1411DMR2G
Description  Sync-Rect PFM Step-Up DC-DC Converter with Low-Battery Detector and Ring-Killer
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Manufacturer  ONSEMI [ON Semiconductor]
Direct Link  http://www.onsemi.com
Logo ONSEMI - ON Semiconductor

NCP1411DMR2G Datasheet(HTML) 2 Page - ON Semiconductor

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NCP1411
http://onsemi.com
2
Figure 1. Typical Operating Circuit
FB
LBI/EN
LBO
REF
OUT
LX
GND
BAT
4
3
2
1
5
6
7
8
150 nF
33
mF
NCP1411
+
350 k
10
mF
22
mH
220 pF
150 pF
200 k
CEN
120 nF
Output 1.5 to 5.5 V
IOUT Typical
Up to 250 mA at
3.3 V Output
and 2.5 V Input
Input
1 V to
VOUT
Low Battery
Sense Input
Shutdown
Open Drain
Input
Low Battery
Open Drain
Output
RLB1
RLB2
PIN FUNCTION DESCRIPTION
Pin #
Symbol
Pin Description
1
FB
Output Voltage Feedback Input.
2
LBI/EN
Low−Battery Detector Input and IC Enable.
3
LBO
Open−Drain Low−Battery Detector Output. Output is LOW when VLBI is < 1.178 V. LBO is high impedance during
shutdown.
4
REF
1.190 V Reference Voltage Output, bypassing with 150 nF capacitor if this pin is not loaded, bypassing with 1.0
mF
if this pin is loaded up to 2.5 mA @ VOUT = 3.3 V.
5
BAT
Battery input connection for internal Ring−Killer.
6
GND
Ground.
7
LX
N−Channel and P−Channel Power MOSFET Drain Connection.
8
OUT
Power Output. OUT also provides bootstrapped power to the device.
MAXIMUM RATINGS
Rating
Symbol
Value
Unit
Device Power Supply (Pin 8)
VOUT
−0.3 to 6.0
V
Input/Output Pins (Pins 1−5, Pin 7)
VIO
−0.3 to 6.0
V
Thermal Characteristics − Micro8 Plastic Package
Maximum Power Dissipation @ TA = 25°C
Thermal Resistance, Junction−to−Air
PD
RqJA
520
240
mW
°C/W
Operating Junction Temperature Range
TJ
−40 to +150
°C
Operating Ambient Temperature Range
TA
−40 to +85
°C
Storage Temperature Range
Tstg
−55 to +150
°C
Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit
values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied,
damage may occur and reliability may be affected.
1. This device contains ESD protection and exceeds the following tests:
Human Body Model (HBM)
"2.0 kV per JEDEC standard: JESD22−A114.
Machine Model (MM)
"200 V per JEDEC standard: JESD22−A115.
2. The maximum package power dissipation limit must not be exceeded.
PD +
TJ(max) * TA
R
qJA
3. Latchup Current Maximum Rating:
"150 mA per JEDEC standard: JESD78.
4. Moisture Sensitivity Level: MSL 1 per IPC/JEDEC standard: J−STD−020A.


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