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MSC1210Y5 Datasheet(PDF) 2 Page - Texas Instruments |
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MSC1210Y5 Datasheet(HTML) 2 Page - Texas Instruments |
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2 / 83 page  MSC1210 SBAS203F − MARCH 2002 − REVISED NOVEMBER 2004 www.ti.com 2 PACKAGE/ORDERING INFORMATION(1) PRODUCT FLASH MEMORY PACKAGE-LEAD PACKAGE DESIGNATOR SPECIFIED TEMPERATURE RANGE PACKAGE MARKING MSC1210Y2 4k TQFP-64 PAG −40 °C to +85°C MSC1210Y2 MSC1210Y2 4k TQFP-64 PAG −40 °C to +85°C MSC1210Y2 MSC1210Y3 8k TQFP-64 PAG −40 °C to +85°C MSC1210Y3 MSC1210Y3 8k TQFP-64 PAG −40 °C to +85°C MSC1210Y3 MSC1210Y4 16k TQFP-64 PAG −40 °C to +85°C MSC1210Y4 MSC1210Y4 16k TQFP-64 PAG −40 °C to +85°C MSC1210Y4 MSC1210Y5 32k TQFP-64 PAG −40 °C to +85°C MSC1210Y5 MSC1210Y5 32k TQFP-64 PAG −40 °C to +85°C MSC1210Y5 (1) For the most current package and ordering information, see the Package Option Addendum at the end of this datasheet, or refer to our web site at www.ti.com. This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. ABSOLUTE MAXIMUM RATINGS(1) MSC1210Yx UNITS Analog Inputs Input current Momentary 100 mA Input current Continuous 10 mA Input voltage AGND − 0.3 to AVDD + 0.3 V Power Supply DVDD to DGND −0.3 to +6 V AVDD to AGND −0.3 to +6 V AGND to DGND −0.3 to +0.3 V VREF to AGND −0.3 to AVDD + 0.3 V Digital input voltage to DGND −0.3 to DVDD + 0.3 V Digital output voltage to DGND −0.3 to DVDD + 0.3 V Maximum junction temperature 150 °C Operating temperature range −40 to +85 °C Storage temperature range −65 to +150 °C Lead temperature (soldering, 10s) +235 °C Package power dissipation (TJ Max − TAMBIENT)/qJA W Output current, all pins 200 mA Output pin short-circuit 10 s Junction to ambient ( qJA) High K (2s 2p) 62.9 °C/W Thermal Resistance Junction to ambient ( qJA) Low K (1s) 78.2 °C/W Thermal Resistance Junction to case ( qJC) 13.8 °C/W Digital Outputs Output current Continuous 100 mA I/O source/sink current 100 mA Power pin maximum 300 mA (1) Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. Exposure to absolute maximum conditions for extended periods may affect device reliability. MSC1210YX FAMILY FEATURES FEATURES(1) MSC1210Y2(2) MSC1210Y3(2) MSC1210Y4(2) MSC1210Y5(2) Flash Program Memory (Bytes) Up to 4k Up to 8k Up to 16k Up to 32k Flash Data Memory (Bytes) Up to 4k Up to 8k Up to 16k Up to 32k Internal Scratchpad RAM (Bytes) 256 256 256 256 Internal MOVX RAM (Bytes) 1024 1024 1024 1024 Externally Accessible Memory (Bytes) 64k Program, 64k Data 64k Program, 64k Data 64k Program, 64k Data 64k Program, 64k Data (1) All peripheral features are the same on all devices; the flash memory size is the only difference. (2) The last digit of the part number (N) represents the onboard flash size = (2N)kBytes. |
Similar Part No. - MSC1210Y5 |
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Similar Description - MSC1210Y5 |
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