5

NIC COMPONENTS CORP. www.niccomp.com www.lowESR.com www.RFpassives.com www.SMTmagnetics.com

SPECIFICATIONS ARE SUBJECT TO CHANGE

NCLS Series

Case Size

A

B

C

0603

5mW & 20mW

0.60

1.10

1.0

6mW ~ 19.5mW

0.85

0.975

0805

6mW ~ 9.5mW

0.80

1.20

1.4

10mW ~ 30mW

1.20

1.00

1206

6mW ~ 9.5mW

1.20

1.75

1.8

10mW ~ 19.5mW

1.80

1.45

20mW ~ 40mW

2.20

1.05

RECOMMENDED LAND PATTERN DIM. (mm)

B

A

C

B

Sensing

Trace

RECOMMENDED REFLOW

SOLDERING TEMPERATURE PROFILE

200

300

250

50

150

100

0

150°C ~ 180°C

120 Sec.

10 sec.

Peak Temperature 260°C

230°C, 40 sec. max.

Case

Size

A

B

K

P

P

1

E

F

D

0

W

Quantity

per Reel

0603 1.10 ± 0.15 1.90 ± 0.2 0.85 ± 0.1

4.0 ± 0.1

2.0 ± 0.1

1.75 ± 0.1 3.5 ± 0.05 1.55 ± 0.1 8.0 ± 0.2

5,000

0805 1.60 ± 0.15 2.40 ± 0.2

1.05 ± 0.1

4.0 ± 0.1

4,000

1206 2.00 ± 0.15 3.60 ± 0.2

PAPER TAPE DIMENSIONS (mm)

D

0

P

1

K

A

P

Bottom

Tape

Top

Tape

Metal Foil Current Sensing Chip Resistors