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K9K4G16U0M Datasheet(PDF) 5 Page - Samsung semiconductor

Part # K9K4G16U0M
Description  512M x 8 Bit / 256M x 16 Bit NAND Flash Memory
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Manufacturer  SAMSUNG [Samsung semiconductor]
Direct Link  http://www.samsung.com/Products/Semiconductor
Logo SAMSUNG - Samsung semiconductor

K9K4G16U0M Datasheet(HTML) 5 Page - Samsung semiconductor

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FLASH MEMORY
5
K9K4G08Q0M
K9K4G16Q0M
K9K4G08U0M
K9K4G16U0M
K9W8G08U1M
PIN DESCRIPTION
NOTE: Connect all VCC and VSS pins of each device to common power supply outputs.
Do not leave VCC or VSS disconnected.
Pin Name
Pin Function
I/O0 ~ I/O7
(K9XXG08XXM)
I/O0 ~ I/O15
(K9K4G16X0M)
DATA INPUTS/OUTPUTS
The I/O pins are used to input command, address and data, and to output data during read operations. The I/
O pins float to high-z when the chip is deselected or when the outputs are disabled.
I/O8 ~ I/O15 are used only in X16 organization device. Since command input and address input are x8 oper-
ation, I/O8 ~ I/O15 are not used to input command & address. I/O8 ~ I/O15 are used only for data input and
output.
CLE
COMMAND LATCH ENABLE
The CLE input controls the activating path for commands sent to the command register. When active high,
commands are latched into the command register through the I/O ports on the rising edge of the WE signal.
ALE
ADDRESS LATCH ENABLE
The ALE input controls the activating path for address to the internal address registers. Addresses are
latched on the rising edge of WE with ALE high.
CE / CE1
CHIP ENABLE
The CE / CE1 input is the device selection control. When the device is in the Busy state, CE / CE1 high is
ignored, and the device does not return to standby mode in program or erase operation. Regarding CE /
CE1 control during read operation, refer to ’Page read’section of Device operation .
CE2
CHIP ENABLE
The CE2 input enables the second K9K4GXXU0M
RE
READ ENABLE
The RE input is the serial data-out control, and when active drives the data onto the I/O bus. Data is valid
tREA after the falling edge of RE which also increments the internal column address counter by one.
WE
WRITE ENABLE
The WE input controls writes to the I/O port. Commands, address and data are latched on the rising edge of
the WE pulse.
WP
WRITE PROTECT
The WP pin provides inadvertent write/erase protection during power transitions. The internal high voltage
generator is reset when the WP pin is active low.
R/B1/ R/B2
READY/BUSY OUTPUT
The R/B / R/B1 output indicates the status of the device operation. When low, it indicates that a program,
erase or random read operation is in process and returns to high state upon completion. It is an open drain
output and does not float to high-z condition when the chip is deselected or when outputs are disabled.
PRE
POWER-ON READ ENABLE
The PRE controls auto read operation executed during power-on. The power-on auto-read is enabled when
PRE pin is tied to Vcc.
Vcc
POWER
VCC is the power supply for device.
Vss
GROUND
N.C
NO CONNECTION
Lead is not internally connected.


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