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T502B685K035AG6310 Datasheet(PDF) 7 Page - Kemet Corporation

Part # T502B685K035AG6310
Description  Tantalum Surface Mount Capacitors ??High Temperature
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Manufacturer  KEMET [Kemet Corporation]
Direct Link  http://www.kemet.com
Logo KEMET - Kemet Corporation

T502B685K035AG6310 Datasheet(HTML) 7 Page - Kemet Corporation

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© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
T2075_T502 • 6/24/2016
77
Tantalum Surface Mount Capacitors – High Temperature
T502 Series MnO2 230°C
Reverse Voltage
Solid tantalum capacitors are polar devices and may be permanently damaged or destroyed if connected with the wrong polarity. The
positiveterminalisidentifiedonthecapacitorbodybyastripe,plusinsomecasesabevelededge.Asmalldegreeoftransientreverse
voltage is permissible for short periods per the below table. The capacitors should not be operated continuously in reverse mode, even
within these limits.
Temperature
Permissible Transient Reverse Voltage
25°C
15% of Rated Voltage
85°C
5% of Rated Voltage
125°C
1% of Rated Voltage
Table 2 – Land Dimensions/Courtyard
KEMET
Metric
Size
Code
Density Level A:
Maximum (Most) Land
Protrusion (mm)
Density Level B:
Median (Nominal) Land
Protrusion (mm)
Density Level C:
Minimum (Least) Land
Protrusion (mm)
Case
EIA
W
L
S
V1
V2
W
L
S
V1
V2
W
L
S
V1
V2
B
3528–21
2.35
2.21
0.92
6.32
4.00
2.23
1.80
1.12
5.22
3.50
2.13
1.42
1.28
4.36
3.24
D
7343–31
2.55
2.77
3.67
10.22
5.60
2.43
2.37
3.87
9.12
5.10
2.33
1.99
4.03
8.26
4.84
Density Level A: For low-density product applications. Recommended for wave solder applications and provides a wider process window for reflow solder processes.
Density Level B: For products with a moderate level of component density. Provides a robust solder attachment condition for reflow solder processes.
Density Level C: For high component desity product applications. Before adapting the minimum land pattern variations the user should perform qualification
testing based on the conditions outlined in IPC standard 7351 (IPC–7351).
¹ Height of these chips may create problems in wave soldering.
2
Land pattern geometry is too small for silkscreen outline.
L
S
W
W
L
V1
V2
Grid Placement Courtyard


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