© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com

T2075_T502 • 6/24/2016

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Tantalum Surface Mount Capacitors – High Temperature

Time

25ºC to Peak

25

Maximum Ramp Up Rate = 3ºC/seconds

Maximum Ramp Down Rate = 6ºC/seconds

Soldering Process

KEMET’sfamiliesofsurfacemountcapacitorsarecompatible

withwave(singleordual),convection,IR,orvaporphasereflow

techniques. Preheating of these components is recommended

to avoid extreme thermal stress. KEMET's recommended

profileconditionsforconvectionandIRreflowreflecttheprofile

conditions of the IPC/J–STD–020D standard for moisture

sensitivity testing. The devices can safely withstand a maximum

ofthreereflowpassesattheseconditions.

Note that although the X/7343–43 case size can withstand wave

soldering,thetallprofile(4.3mmmaximum)dictatescareinwave

process development.

Hand soldering should be performed with care due to the

difficultyinprocesscontrol.Ifperformed,careshouldbetakento

avoid contact of the soldering iron to the molded case. The iron

should be used to heat the solder pad, applying solder between

thepadandthetermination,untilreflowoccurs.Oncereflow

occurs,theironshouldberemovedimmediately.“Wiping”the

edges of a chip and heating the top surface is not recommended.

Profile Feature

SnPb Assembly Pb-Free Assembly

Preheat/Soak

100°C

150°C

150°C

200°C

60 – 120 seconds

60 – 120 seconds

3°C/secondsmaximum

3°C/secondsmaximum

183°C

217°C

60 – 150 seconds

60 – 150 seconds

220°C*

235°C**

250°C*

260°C**

Timewithin5°CofMaximum

20 seconds maximum

30 seconds maximum

6°C/secondsmaximum

6°C/secondsmaximum

Time25°CtoPeakTemperature

6 minutes maximum

8 minutes maximum

Note: All temperatures refer to the center of the package, measured on the

package body surface that is facing up during assembly reflow.

*Case Size D, E, P, Y, and X

**Case Size A, B, C, H, I, K, M, R, S, T, U, V, W, and Z

Storage

Tantalumchipcapacitorsshouldbestoredinnormalworkingenvironments.Whilethechipsthemselvesarequiterobustinother

environments, solderability will be degraded by exposure to high temperatures, high humidity, corrosive atmospheres, and long term

storage. In addition, packaging materials will be degraded by high temperature reels may soften or warp and tape peel force may

increase.KEMETrecommendsthatmaximumstoragetemperaturenotexceed40ºCandmaximumstoragehumiditynotexceed60%

relativehumidity.Temperaturefluctuationsshouldbeminimizedtoavoidcondensationonthepartsandatmospheresshouldbefreeof

chlorine and sulphur bearing compounds. For optimized solderability chip stock should be used promptly, preferably within three years

of receipt.