NCV8177

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2

Figure 2. Internal Block Diagram

IN

EN

OUT

GND

VOLTAGE REFERENCE

AND

SOFT−START

0.7 V

THERMAL

SHUTDOWN

VOLTAGE REFERENCE

AND

SOFT−START

0.7 V

THERMAL

SHUTDOWN

NCV8177A (with active discharge)

NCV8177B (without active discharge)

IN

EN

OUT

GND

PIN FUNCTION DESCRIPTION

Pin No.

Pin Name

Description

1

OUT

Regulated output voltage pin

2

GND

Power supply ground pin

3

EN

Enable pin (active “H”)

4

IN

Power supply input voltage pin

−

EPAD

Exposed pad should be tied to ground plane for better power dissipation

ABSOLUTE MAXIMUM RATINGS

Rating

Symbol

Value

Unit

Input Voltage (Note 1)

IN

−0.3 to 6.0

V

Output Voltage

OUT

V

Chip Enable Input

EN

−0.3 to 6.0

V

Output Current

Internally Limited

mA

Operating Ambient Temperature Range

−40 to +125

°C

Maximum Junction Temperature

150

°C

Storage Temperature

−55 to 150

°C

ESD Capability, Human Body Model (Note 2)

2000

V

ESD Capability, Machine Model (Note 2)

200

V

Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality

should not be assumed, damage may occur and reliability may be affected.

1. Refer to ELECTRICAL CHARACTERISTICS and APPLICATION INFORMATION for Safe Operating Area.

2. This device series incorporates ESD protection and is tested by the following methods:

ESD Human Body Model tested per JESD22−A114

ESD Machine Model tested per JESD22−A115

Latchup Current Maximum Rating tested per JEDEC standard: JESD78

THERMAL CHARACTERISTICS

Rating

Symbol

Value

Unit

Thermal Characteristics, XDFN4 (Note 3)

Thermal Resistance, Junction−to−Air

223

°C/W

3. Measured according to JEDEC board specification. Detailed description of the board can be found in JESD51−7

RECOMMENDED OPERATING CONDITIONS

Rating

Symbol

Min

Max

Unit

Input Voltage

1.6

5.5

V

Junction Temperature

−40

125

°C

Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond

the Recommended Operating Ranges limits may affect device reliability.