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UCC27321 Datasheet(PDF) 2 Page - Texas Instruments

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Part # UCC27321
Description  SINGLE 9-A HIGH SPEED LOW SIDE MOSFET DRIVER WITH ENABLE
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Manufacturer  TI [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI - Texas Instruments

UCC27321 Datasheet(HTML) 2 Page - Texas Instruments

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UCC27321, UCC27322
UCC37321, UCC37322
SLUS504C − SEPTEMBER 2002 − REVISED NOVEMBER 2004
2
www.ti.com
description (continued)
Using a design that inherently minimizes shoot-through current, the outputs of these can provide high gate drive
current where it is most needed at the Miller plateau region during the MOSFET switching transition. A unique
hybrid output stage paralleling bipolar and MOSFET transistors (TrueDrive) allows efficient current delivery at
low supply voltages. With this drive architecture, UCC37321/2/3 can be used in industry standard 6-A, 9-A and
many 12-A driver applications. Latch up and ESD protection circuitries are also included. Finally, the
UCC37321/2 provides an enable (ENBL) function to have better control of the operation of the driver
applications. ENBL is implemented on pin 3 which was previously left unused in the industry standard pin−out.
It is internally pulled up to Vdd for active high logic and can be left open for standard operation.
In addition to SOIC-8 (D) and PDIP-8 (P) package offerings, the UCC37321/2 also comes in the thermally
enhanced but tiny 8-pin MSOP PowerPAD
t (DGN) package. The PowerPADt package drastically lowers the
thermal resistance to extend the temperature operation range and improve the long-term reliability.
absolute maximum ratings over operating free-air temperature (unless otherwise noted)†}
UCCx732x
UNIT
Supply voltage, VDD
−0.3 to 16
V
Output current (OUT) DC, IOUT_DC
0.6
A
Input voltage (IN), VIN
−5 V to 6 V or VDD+0.3
(whichever is larger)
V
Enable voltage (ENBL)
−0.3 V to 6 V or VDD+0.3
(whichever is larger)
V
Power dissipation at TA = 25°C
D package
650
mW
DGN package
3
W
P package
350
mW
Junction operating temperature, TJ
−55 to 150
°C
Storage temperature, Tstg
−65 to 150
°C
Lead temperature (soldering, 10 sec.)
300
°C
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
‡ All voltages are with respect to GND. Currents are positive into, negative out of the specified terminal.
ordering information
OUTPUT
TEMPERATURE
PACKAGED DEVICES
OUTPUT
CONFIGURATION
TEMPERATURE
RANGE TA = TJ
SOIC-8 (D)
MSOP-8 PowerPAD
(DGN)
PDIP-8 (P)
Inverting
−40
°C to +105°C
UCC27321D
UCC27321DGN
UCC27321P
Inverting
0
°C to +70°C
UCC37321D
UCC37321DGN
UCC37321P
NonInverting
−40
°C to +105°C
UCC27322D
UCC27322DGN
UCC27322P
NonInverting
0
°C to +70°C
UCC37322D
UCC37322DGN
UCC37322P
† D (SOIC−8) and DGN (PowerPAD−MSOP) packages are available taped and reeled. Add R suffix to device type (e.g.
UCC37321DR, UCC37322DGNR) to order quantities of 2,500 devices per reel.


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