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NCV8154MW180280TBG Datasheet(PDF) 3 Page - ON Semiconductor |
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NCV8154MW180280TBG Datasheet(HTML) 3 Page - ON Semiconductor |
3 / 18 page NCV8154 www.onsemi.com 3 Table 2. PIN FUNCTION DESCRIPTION − WDFN6 Pin No. Pin Name Description 1 EN1 Driving EN1 over 0.9 V turns-on OUT1. Driving EN below 0.4 V turns-off the OUT1. 2 IN Inputs pin. It is recommended to connect at least 1 mF ceramic capacitor close to the device pin. 3 EN2 Driving EN2 over 0.9 V turns-on OUT2. Driving EN below 0.4 V turns-off the OUT2. 4 GND Power supply ground. Soldered to the copper plane allows for effective heat dissipation. 5 OUT2 Regulated output voltage of the second channel. A small 1 mF ceramic capacitor is needed from this pin to ground to assure stability. 6 OUT1 Regulated output voltage of the first channel. A small 1 mF ceramic capacitor is needed from this pin to ground to assure stability. Table 3. ABSOLUTE MAXIMUM RATINGS Rating Symbol Value Unit Input Voltage (Note 1) VIN1, VIN2 −0.3 V to 6 V V Output Voltage VOUT1, VOUT2 −0.3 V to VIN + 0.3 V or 6 V V Enable Inputs VEN1, VEN2 −0.3 V to VIN + 0.3 V or 6 V V Output Short Circuit Duration tSC Indefinite s Operating Ambient Temperature Range TA −40 to +125 °C Maximum Junction Temperature TJ(MAX) 150 °C Storage Temperature TSTG −55 to 150 °C ESD Capability, Human Body Model (Note 2) ESDHBM 2,000 V ESD Capability, Machine Model (Note 2) ESDMM 200 V Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. Refer to ELECTRICAL CHARACTERISTICS and APPLICATION INFORMATION for Safe Operating Area. 2. This device series incorporates ESD protection and is tested by the following methods: ESD Human Body Model tested per AEC−Q100−002 (EIA/JESD22−A114) ESD Machine Model tested per AEC−Q100−003 (EIA/JESD22−A115) Latchup Current Maximum Rating tested per JEDEC standard: JESD78. Table 4. THERMAL CHARACTERISTICS (Note 3) Rating Symbol Value Unit Thermal Characteristics, DFN10 3 × 3 mm, Thermal Resistance, Junction-to-Air qJA 109 °C/W Thermal Characteristics, WDFN6 1.5 × 1.5 mm, Thermal Resistance, Junction-to-Air qJA 207 °C/W 3. Single component mounted on 1 oz, FR4 PCB with 645 mm2 Cu area. RECOMMENDED OPERATING CONDITIONS Parameter Symbol Min Max Unit Input Voltage VIN 1.9 5.25 V Junction Temperature TJ −40 125 °C Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond the Recommended Operating Ranges limits may affect device reliability. |
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