NCD5701A, NCD5701B, NCD5701C

www.onsemi.com

7

Rating

Symbol

Minimum

Maximum

Unit

Differential Power Supply

0

36

V

Positive Power Supply

−0.3

22

V

Negative Power Supply

−18

0.3

V

Gate Output High

V

Gate Output Low

V

Input Voltage

−0.3

5.5

V

DESAT Voltage

−0.3

V

FLT current

Sink

Source

20

25

mA

Power Dissipation

SO−8 package

PD

700

mW

Maximum Junction Temperature

150

°C

Storage Temperature Range

TSTG

−65 to 150

°C

ESD Capability, Human Body Model (Note 2)

ESDHBM

4

kV

ESD Capability, Machine Model (Note 2)

ESDMM

200

V

Moisture Sensitivity Level

MSL

1

−

Lead Temperature Soldering

Reflow (SMD Styles Only), Pb−Free Versions (Note 3)

260

°C

Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality

should not be assumed, damage may occur and reliability may be affected.

1. Refer to ELECTRICAL CHARACTERISTICS and APPLICATION INFORMATION for Safe Operating Area.

2. This device series incorporates ESD protection and is tested by the following methods:

ESD Human Body Model tested per AEC−Q100−002 (EIA/JESD22−A114)

ESD Machine Model tested per AEC−Q100−003 (EIA/JESD22−A115)

Latchup Current Maximum Rating:

≤100 mA per JEDEC standard: JESD78, 25°C

3. For information, please refer to our Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.

Table 3. THERMAL CHARACTERISTICS

Rating

Symbol

Value

Unit

Thermal Characteristics, SOIC−8 (Note 4)

Thermal Resistance, Junction−to−Air (Note 5)

176

°C/W

4. Refer to ELECTRICAL CHARACTERISTICS and APPLICATION INFORMATION for Safe Operating Area.

Rating

Symbol

Min

Max

Unit

Differential Power Supply

30

V

Positive Power Supply

UVLO

20

V

Negative Power Supply

−15

0

V

Input Voltage

0

5

V

Input pulse width

40

ns

Ambient Temperature

−40

125

°C

6. Refer to ELECTRICAL CHARACTERISTICS and APPLICATION INFORMATION for Safe Operating Area.

Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond

the Recommended Operating Ranges limits may affect device reliability.