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OPA1632DGN Datasheet(PDF) 8 Page - Texas Instruments |
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OPA1632DGN Datasheet(HTML) 8 Page - Texas Instruments |
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8 / 12 page  OPA1632 SBOS286 − DECEMBER 2003 www.ti.com 8 The PowerPAD package allows for both assembly and thermal management in one manufacturing operation. During the surface-mount solder operation (when the leads are being soldered), the thermal pad can also be soldered to a copper area underneath the package. Through the use of thermal paths within this copper area, heat can be conducted away from the package into either a ground plane or other heat-dissipating device. PowerPAD PCB LAYOUT CONSIDERATIONS 1. Prepare the printed circuit board (PCB) with a top-side etch pattern, as shown in Figure 4. There should be etch for the leads as well as etch for the thermal pad. 68mils x 70mils (via diameter = 13mils) Single or Dual Figure 4. PowerPAD PCB Etch and Via Pattern. 2. Place five holes in the area of the thermal pad. These holes should be 13mils in diameter. Keep them small so that solder wicking through the holes is not a problem during reflow. 3. Additional vias may be placed anywhere along the thermal plane outside of the thermal pad area. These vias help dissipate the heat generated by the OPA1632 IC, and may be larger than the 13mil diameter vias directly under the thermal pad. They can be larger because they are not in the thermal pad area to be soldered so that wicking is not a problem. 4. Connect all holes to the internal ground plane. 5. When connecting these holes to the ground plane, do not use the typical web or spoke via connection methodology. Web connections have a high thermal resistance connection that is useful for slowing the heat transfer during soldering operations. This makes the soldering of vias that have plane connections easier. In this application, however, low thermal resistance is desired for the most efficient heat transfer. Therefore, the holes under the OPA1632 PowerPAD package should make their connection to the internal ground plane with a complete connection around the entire circumference of the plated-through hole. 6. The top-side solder mask should leave the terminals of the package and the thermal pad area with its five holes exposed. The bottom-side solder mask should cover the five holes of the thermal pad area. This prevents solder from being pulled away from the thermal pad area during the reflow process. 7. Apply solder paste to the exposed thermal-pad area and all of the IC terminals. 8. With these preparatory steps in place, the IC is simply placed in position and runs through the solder reflow operation as any standard surface-mount component. This results in a part that is properly installed. |
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