- Content -

Page

1. FEATURES

-------------------------------------------------------------------------------------------------

4

2. GENERAL DESCRIPTION

-----------------------------------------------------------------------------

5

3. MEMORY ORGANIZATION

--------------------------------------------------------------------------

6

4. DEVICE OPERATION

----------------------------------------------------------------------------------

6

5. DATA PROTECTION

------------------------------------------------------------------------------------

6

6. STATUS REGISTER

-------------------------------------------------------------------------------------

7

7. COMMANDS DESCRIPTION

-------------------------------------------------------------------------

8

TABLE OF ID DEFINITION

------------------------------------------------------------------------------

9

7.1. Write enable (wren) (06H)

--------------------------------------------------------------------------

10

7.2. Write disable (WRDI) (04H)

------------------------------------------------------------------------

10

7.3. Read status register (WDSR) (05H)

----------------------------------------------------------------

10

7.4. Write status register (WRSR) (01H)

---------------------------------------------------------------

11

7.5. Read data bytes (READ) (03H)

---------------------------------------------------------------------

12

7.6. Read data bytes at higher speed (Fast read) (0BH)

----------------------------------------------

12

7.7. Dual output fast read (3BH)

-------------------------------------------------------------------------

13

7.8. Page program (PP) (02H)

----------------------------------------------------------------------------

13

7.9. Fast page program (FPP) (F2H)

--------------------------------------------------------------------

14

7.10. Sector erase (SE) (20H)

-----------------------------------------------------------------------------

15

7.11. 32KB Block erase (BE) (52H)

---------------------------------------------------------------------

16

7.12. 64KB Block erase (BE) (D8H)

---------------------------------------------------------------------

16

7.13. Chip erase (CE) (60/C7H)

--------------------------------------------------------------------------

17

7.14. Deep power-down (DP) (B9H)

---------------------------------------------------------------------

17

7.15. Release from deep power-down / read device ID (ABH)

---------------------------------------

18

7.16. Read manufacture ID / device ID (REMS) (90H)

------------------------------------------------

19

7.17. Read identification (RDID) (9FH)

-----------------------------------------------------------------

20

8. ELECTRICAL CHARACTERISTICS

---------------------------------------------------------------

21

8.1. Power-ON timing

-------------------------------------------------------------------------------------

21

8.2. Initial delivery state

----------------------------------------------------------------------------------

21

8.3. Data retention and endurance

-----------------------------------------------------------------------

21

8.4. Latch up characteristics

-----------------------------------------------------------------------------

21

8.5. Absolute maximum ratings

-------------------------------------------------------------------------

22

8.6. Capacitance measurement conditions

-------------------------------------------------------------

22

8.7. DC characteristics

-----------------------------------------------------------------------------------

23

8.8. AC characteristics

-----------------------------------------------------------------------------------

24

http://www.elm-tech.com