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TPS61230ARNST Datasheet(PDF) 4 Page - Texas Instruments |
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TPS61230ARNST Datasheet(HTML) 4 Page - Texas Instruments |
4 / 28 page 4 TPS61230A SLVSCZ5A – JULY 2016 – REVISED AUGUST 2016 www.ti.com Product Folder Links: TPS61230A Submit Documentation Feedback Copyright © 2016, Texas Instruments Incorporated (1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods my affect device reliability. (2) All voltages are with respect to network ground terminal. 7 Specifications 7.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) MIN MAX UNIT Voltage range at terminals (2) VIN, EN, VOUT, FB -0.3 6 V SW -0.3 7 V CBST -0.3 12 V Operating junction temperature range, TJ -40 150 °C Storage temperature range, Tstg -65 150 °C (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. Manufacturing with less than 500-V HBM is possible with the necessary precautions. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. Manufacturing with less than 250-V CDM is possible with the necessary precautions. 7.2 ESD Ratings VALUE UNIT V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000 V Charged-device model (CDM), per JEDEC specification JESD22- C101(2) ±750 7.3 Recommended Operating Conditions MIN TYP MAX UNIT VIN Input voltage range 2.5 4.5 V VOUT Output voltage range 5.5 V L Effective inductance range 0.47 1 1.3 µH CI Effective input capacitance range 1 10 µF CO Effective output capacitance range 15 22 80 µF TJ Operating junction temperature -40 125 °C (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report. 7.4 Thermal Information THERMAL METRIC(1) TPS61230A UNIT RNS (VQFN) 7 PIN RθJA Junction-to-ambient thermal resistance (no vias) 93 °C/W RθJA Junction-to-ambient thermal resistance (with vias underneath) 56 °C/W RθJB Junction-to-board thermal resistance 28.4 °C/W RθJC Junction-to-case thermal resistance 57.8 °C/W ψJT Junction-to-top characterization parameter 2.0 °C/W ψJB Junction-to-board characterization parameter 28.1 °C/W |
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