TPS61162A, TPS61163A

SLVSC26A – NOVEMBER 2013 – REVISED JUNE 2015

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6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

VIN, EN, PWM, IFB1, IFB2

–0.3

7

COMP, ISET

–0.3

3

V

SW

–0.3

40

Continuous power dissipation

See Thermal Information

Operating junction temperature

–40

150

°C

Storage temperature

–65

150

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

All voltage values are with respect to network ground terminal.

6.2 ESD Ratings

VALUE

UNIT

±2000

Electrostatic discharge

±750

V

Machine model (MM)

200 (max)

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

Input voltage

2.7

6.5

V

TPS61162A

Output voltage

TPS61163A

L

Inductor

4.7

10

µH

Input capacitor

1

µF

Output capacitor

1

2.2

µF

Compensation capacitor

330

nF

PWM dimming signal frequency

10

100

kHz

Operating junction temperature

–40

125

°C

6.4 Thermal Information

TPS61162A/63A

YFF (DSBGA)

UNIT

9 PINS

Junction-to-ambient thermal resistance

107

°C/W

Junction-to-case (top) thermal resistance

0.9

°C/W

Junction-to-board thermal resistance

18.1

°C/W

Junction-to-top characterization parameter

4.0

°C/W

Junction-to-board characterization parameter

18

°C/W

Junction-to-case (bottom) thermal resistance

NA

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

4

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