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TPS61162AYFFR Datasheet(PDF) 4 Page - Texas Instruments |
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TPS61162AYFFR Datasheet(HTML) 4 Page - Texas Instruments |
4 / 35 page TPS61162A, TPS61163A SLVSC26A – NOVEMBER 2013 – REVISED JUNE 2015 www.ti.com 6 Specifications 6.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) MIN MAX UNIT VIN, EN, PWM, IFB1, IFB2 –0.3 7 Voltage(2) COMP, ISET –0.3 3 V SW –0.3 40 PD Continuous power dissipation See Thermal Information TJ Operating junction temperature –40 150 °C Tstg Storage temperature –65 150 (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) All voltage values are with respect to network ground terminal. 6.2 ESD Ratings VALUE UNIT Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000 V(ESD) Electrostatic discharge Charged-device model (CDM), per JEDEC specification JESD22-C101(2) ±750 V Machine model (MM) 200 (max) (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 6.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN NOM MAX UNIT VIN Input voltage 2.7 6.5 V TPS61162A VOUT Output voltage TPS61163A L Inductor 4.7 10 µH CI Input capacitor 1 µF CO Output capacitor 1 2.2 µF CCOMP Compensation capacitor 330 nF FPWM PWM dimming signal frequency 10 100 kHz TJ Operating junction temperature –40 125 °C 6.4 Thermal Information TPS61162A/63A THERMAL METRIC(1) YFF (DSBGA) UNIT 9 PINS RθJA Junction-to-ambient thermal resistance 107 °C/W RθJC(top) Junction-to-case (top) thermal resistance 0.9 °C/W RθJB Junction-to-board thermal resistance 18.1 °C/W ψJT Junction-to-top characterization parameter 4.0 °C/W ψJB Junction-to-board characterization parameter 18 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance NA °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953. 4 Submit Documentation Feedback Copyright © 2013–2015, Texas Instruments Incorporated Product Folder Links: TPS61162A TPS61163A |
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