4

TPS61021A

SLVSDM0 – JUNE 2016

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Copyright © 2016, Texas Instruments Incorporated

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

All voltage values are with respect to network ground terminal.

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

EN, FB

DC

–0.3

3.6

V

VIN, SW, VOUT

DC

–0.3

4.6

V

10% duty cycle

–0.3

4.8

V

–40

150

°C

–65

150

°C

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. Manufacturing with

less than 500-V HBM is possible with the necessary precautions. Pins listed as ±2000 V may actually have higher performance.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. Manufacturing with

less than 250-V CDM is possible with the necessary precautions. Pins listed as ±500 V may actually have higher performance.

6.2 ESD Ratings

VALUE

UNIT

Electrostatic discharge

±2000

V

Charged-device model (CDM), per JEDEC specification JESD22-

±500

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

Input voltage range

0.5

4.4

V

Output voltage setting range

1.8

4.0

V

L

Effective inductance range

0.2

0.47

1.3

µH

Effective input capacitance range

1.0

4.7

µF

Effective output capacitance range

3.0

10

200

µF

10

20

200

µF

Operating junction temperature

–40

125

°C

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

6.4 Thermal Information

TPS61021A

UNIT

DSG (WSON)

8 PINS

Junction-to-ambient thermal resistance

71.1

°C/W

Junction-to-case (top) thermal resistance

95.2

°C/W

Junction-to-board thermal resistance

41.6

°C/W

Junction-to-top characterization parameter

3.1

°C/W

Junction-to-board characterization parameter

42.0

°C/W

Junction-to-case (bottom) thermal resistance

13.0

°C/W