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TPS54980PWP Datasheet(PDF) 11 Page - Texas Instruments |
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TPS54980PWP Datasheet(HTML) 11 Page - Texas Instruments |
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11 / 22 page  TPS54980 SLVS452A − FEBRUARY 2003 − REVISED FEBRUARY 2005 www.ti.com 11 LAYOUT CONSIDERATIONS FOR THERMAL PERFORMANCE For operation at full rated load current, the analog ground plane must provide an adequate heat dissipating area. A 3-inch by 3-inch plane of 1 ounce copper is recommended, though not mandatory, depending on ambient temperature and airflow. Most applications have larger areas of internal ground plane available, and the PowerPAD must be connected to the largest area available. Additional areas on the top or bottom layers also help dissipate heat, and any area available must be used when 9 A or greater operation is desired. Connection from the exposed area of the PowerPAD to the analog ground plane layer must be made using 0.013 inch diameter vias to avoid solder wicking through the vias. Eight vias must be in the PowerPAD area with four additional vias located under the device package. The size of the vias under the package, but not in the exposed thermal pad area, can be increased to 0.018. Additional vias beyond the twelve recommended that enhance thermal performance must be included in areas not under the device package. Connect Pin 1 to Analog Ground Plane in This Area for Optimum Performance Minimum Recommended Top Side Analog Ground Area 0.3478 0.0150 0.06 0.0256 0.1700 0.1340 0.0630 0.0400 Ø 0.0180 4 PL 0.2090 Ø 0.0130 8 PL Minimum Recommended Exposed Copper Area for Powerpad. 5mil Stencils May Require 10 Percent Larger Area 0.0650 0.0500 0.0500 0.0650 0.0339 0.0339 0.0500 Minimum Recommended Thermal Vias: 8 x 0.013 Diameter Inside Powerpad Area 4 x 0.018 Diameter Under Device as Shown. Additional 0.018 Diameter Vias May Be Used if Top Side Analog Ground Area Is Extended. 0.3820 Figure 11. Recommended Land Pattern for 28-Pin PWP PowerPAD |
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