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TPS54372PWP Datasheet(PDF) 9 Page - Texas Instruments

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Part # TPS54372PWP
Description  3-A OUTPUT TRACKING/TERMINATION SYNCHRONOUS PWM SWITCHER WITH INTEGRATED FETs
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Manufacturer  TI1 [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI1 - Texas Instruments

TPS54372PWP Datasheet(HTML) 9 Page - Texas Instruments

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OPERATING FREQUENCY
R +
500 kHz
Switching Frequency
100 [kW]
OUTPUT FILTER
PCB LAYOUT
LAYOUT CONSIDERATIONS FOR THERMAL
TPS54372
SLVS430D – JUNE 2002 – REVISED FEBRUARY 2005
separate wide trace for the analog ground signal
path. This analog ground should be used for the
In the application circuit, RT is grounded through a
voltage set-point divider, timing resistor RT, and bias
71.5-k
Ω resistor to select the operating frequency of
capacitor grounds. Connect this trace directly to
700 kHz. To set a different frequency, place a 68-k
AGND (pin 1).
to 180-k
Ω resistor between RT (pin 20) and analog
ground or leave RT floating to select the default of
The PH pins should be tied together and routed to
350 kHz. The resistance can be approximated using
the output inductor. Because the PH connection is
the following equation:
the switching node, the inductor should be located
close to the PH pins, and the area of the PCB
conductor minimized to prevent excessive capacitive
coupling.
Connect the boot capacitor between the phase node
and the BOOT pin as shown. Keep the boot capacitor
The output filter is composed of a 1.0-µH inductor
close to the IC and minimize the conductor trace
and two 150-µF capacitors. The inductor is a low dc
lengths. Connect the output filter capacitor(s) as
resistance (0.010
Ω) type, Vishay IHLP-2525CZ-01
shown, between the VOUT trace and PGND. It is
1.0-µH, 8.5-A rated dc output. The capacitors used
important to keep the loop formed by the PH pins,
are 150-µF, 6.3-V special polymer types.
Lout, Cout, and PGND as small as practical.
Place the compensation components from the VOUT
trace to the VSENSE and COMP pins. Do not place
Figure 9 shows a generalized PCB layout guide for
these components too close to the PH trace. Due to
the TPS54372.
the size of the IC package and the device pinout,
they have to be routed somewhat close, but maintain
The VIN pins should be connected together on the
as much separation as possible while still keeping the
printed-circuit board (PCB) and bypassed with a
layout compact.
low-ESR ceramic bypass capacitor. Care should be
taken to minimize the loop area formed by the bypass
Connect the bias capacitor from the VBIAS pin to
capacitor
connections,
the
VIN
pins,
and
the
analog ground using the isolated analog ground
TPS54372 ground pins. The minimum recommended
trace. If an RT resistor is used, connect it to this trace
bypass capacitance is 10-µF ceramic with a X5R- or
as well.
X7R-grade dielectric, and the optimum placement is
closest to the VIN pins and the PGND pins.
PERFORMANCE
The TPS54372 has two internal grounds (analog and
power). Inside the TPS54372, the analog ground ties
For operation at full rated load current, the analog
to all of the noise-sensitive signals, while the power
ground plane must provide adequate heat dissipating
ground ties to the noisier power signals. Noise
area. A 3-inch by 3-inch plane of 1-ounce copper is
injected between the two grounds can degrade the
recommended, though not mandatory, depending on
performance of the TPS54372, particularly at higher
ambient temperature and airflow. Most applications
output currents. Ground noise on an analog ground
have larger areas of internal ground plane available,
plane can also cause problems with some of the
and the PowerPAD should be connected to the
control and bias signals. For these reasons, separate
largest area available. Additional areas on the top or
analog and power ground traces are recommended.
bottom layers also help dissipate heat, and any area
There should be an area of ground on the top layer
available should be used when 3-A or greater oper-
directly under the IC, with an exposed area for
ation is desired. Connection from the exposed area of
connection to the PowerPAD. Use vias to connect
the PowerPAD to the analog ground plane layer
this ground area to any internal ground planes. Use
should be made using 0.013-inch diameter vias to
additional vias at the ground side of the input and
avoid solder wicking through the vias. Six vias should
output filter capacitors as well. The AGND and PGND
be in the PowerPAD area with four additional vias
pins should be tied to the PCB ground by connecting
located under the device package. The size of the
them to the ground area under the device as shown.
vias under the package, but not in the exposed
The only components that should tie directly to the
thermal pad area, can be increased to 0.018 inch.
power ground plane are the input capacitors, the
Additional vias beyond the ten recommended that
output capacitors, the input voltage decoupling ca-
enhance thermal performance should be included in
pacitor, and the PGND pins of the TPS54372. Use a
areas not under the device package.
9


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