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TPS54328 Datasheet(PDF) 3 Page - Texas Instruments

Part # TPS54328
Description  TPS54328 4.5-V to 18-V Input, 3-A Synchronous Step-Down Converter With Eco-Mode
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Manufacturer  TI1 [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI1 - Texas Instruments

TPS54328 Datasheet(HTML) 3 Page - Texas Instruments

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background image
1
EN
10
VIN
2
VFB
9
VIN
3
VREG5
8
VBST
4
SS
7
SW
5
GND
6
SW
Not to scale
Thermal Pad
1
EN
8
VIN
2
VFB
7
VBST
3
VREG5
6
SW
4
SS
5
GND
Not to scale
Thermal Pad
3
TPS54328
www.ti.com
SLVSAN2D – NOVEMBER 2010 – REVISED AUGUST 2016
Product Folder Links: TPS54328
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Copyright © 2010–2016, Texas Instruments Incorporated
5 Pin Configuration and Functions
DDA Package
8-Pin HSOP
Top View
DRC Package
10-Pin VSON
Top View
Pin Functions
PIN
I/O
DESCRIPTION
NAME
HSOP
VSON
EN
1
1
I
Enable input control. Active high.
GND
5
Ground pin. Power ground return for switching circuit. Connect sensitive SS and VFB
returns to GND at a single point.
5
Ground pin. Connect sensitive SS and VFB returns to GND at a single point.
SS
4
4
I
Soft-start control. An external capacitor must be connected to GND.
SW
6
6, 7
O
Switch node connection between high-side NFET and low-side NFET.
VBST
7
8
I
Supply input for the high-side FET gate drive circuit. Connect 0.1-µF capacitor between
VBST and SW pins. An internal diode is connected between VREG5 and VBST.
VFB
2
2
I
Converter feedback input. Connect to output voltage with feedback resistor divider.
VIN
8
9, 10
I
Input voltage supply pin.
VREG5
3
3
O
5.5-V power-supply output. A capacitor (typically 1 µF) must be connected to GND. VREG5
is not active when EN is low.
Exposed
Thermal
Pad
Back side
Thermal pad of the package. Must be soldered to achieve appropriate dissipation. Must be
connected to GND.
Back side
Thermal pad of the package. PGND power ground return of internal low-side FET. Must be
soldered to achieve appropriate dissipation.


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