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TLC277 Datasheet(PDF) 3 Page - Texas Instruments |
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TLC277 Datasheet(HTML) 3 Page - Texas Instruments |
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3 / 53 page  TLC272, TLC272A, TLC272B, TLC272Y, TLC277 LinCMOS PRECISION DUAL OPERATIONAL AMPLIFIERS SLOS091E – OCTOBER 1987 – REVISED FEBRUARY 2002 3 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 equivalent schematic (each amplifier) P5 P6 OUT N7 N6 R7 N4 C1 R5 N3 GND N2 D2 R4 D1 R3 N1 IN + IN – P1 R1 P2 R2 N5 R6 P3 P4 VDD TLC272Y chip information This chip, when properly assembled, displays characteristics similar to the TLC272C. Thermal compression or ultrasonic bonding may be used on the doped-aluminum bonding pads. Chips may be mounted with conductive epoxy or a gold-silicon preform. BONDING PAD ASSIGNMENTS CHIP THICKNESS: 15 TYPICAL BONDING PADS: 4 × 4 MINIMUM TJmax = 150°C TOLERANCES ARE ±10%. ALL DIMENSIONS ARE IN MILS. PIN (4) IS INTERNALLY CONNECTED TO BACKSIDE OF CHIP. + – 1OUT 1IN + 1IN – VDD (8) (6) (3) (2) (5) (1) – + (7) 2IN + 2IN – 2OUT (4) GND 60 73 |
Similar Part No. - TLC277 |
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Similar Description - TLC277 |
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