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Formosa MS

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Document ID

Issued Date

Revised Date

Revision

Page.

EGFM301 THRU EGFM305

DS-121522

2009/08/10

2010/03/10

D

7

Chip Effcienct Fast Rectifiers

1. Solder Resistance

2. Solderability

3. High Temperature Reverse Bias

4. Forward Operation Life

5. Intermittent Operation Life

6. Pressure Cooker

7. Temperature Cycling

8. Forward Surge

9. Humidity

10. High Temperature Storage Life

at 260 5

for 10 2sec.

immerse body into solder 1/16"±1/32"

O

at 245±5 C for 5 sec.

O

V =80% rate at T =150 C for 168 hrs.

R

J

O

Rated average rectifier current at T =25 C for 500hrs.

A

O

T = 25 C, I = I

A

F

O

On state: power on for 5 min.

off state: power off for 5 min.

on and off for 500 cycles.

O

15P

at T =121 C for 4 hrs.

SIG

A

O

O

-55 C to +125 C dwelled for 30 min.

and transferred for 5min. total 10 cycles.

8.3ms single half sine-wave , one surge.

O

at T =85 C, RH=85% for 1000hrs.

A

O

at 175 C for 1000 hrs.

O

±

C

±

MIL-STD-750D

METHOD-2031

MIL-STD-202F

METHOD-208

MIL-STD-750D

METHOD-1038

MIL-STD-750D

METHOD-1027

MIL-STD-750D

METHOD-1036

JESD22-A102

MIL-STD-750D

METHOD-1051

MIL-STD-750D

METHOD-4066-2

MIL-STD-750D

METHOD-1021

MIL-STD-750D

METHOD-1031

Item Test

Conditions

Reference

High reliability test capabilities