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TPS53624RHAT Datasheet(PDF) 2 Page - Texas Instruments |
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TPS53624RHAT Datasheet(HTML) 2 Page - Texas Instruments |
2 / 44 page TPS53624 SLUSB66 – MARCH 2013 www.ti.com This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. ABSOLUTE MAXIMUM RATINGS Over operating free-air temperature range (unless otherwise noted, all voltages are with respect to GND.) (1) VALUE UNIT MIN MAX VBST1, VBST2 –0.3 36 VBST1to LL1. VBST2 to LL2 –0.3 6 Input voltage range(2) V CSP1, CSN1, CSP2, CSN2, MODE, OSRSEL, PCNT, SLEW, THRM, TRIPSEL, TONSEL, V5FILT, V5IN, VID0, VID1, VID2, –0.3 6 VID3, VID4, VID5, VID6, VID7, VFB, EN, THAL LL1, LL2 –5 30 DRVH1, DRVH2 –5 36 Output voltage range(2) DRVH1, DRVH2 to LL1 or LL2 –0.3 6 V VREF, DROOP, DRVL1, DRVL2, IMON, PG, PGD –0.3 6 PGND, GFB –0.3 0.3 Operating junction temperature, TJ –40 125 °C Storage junction temperature, Tstg –55 150 (1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) All voltage values are with respect to the network ground terminal unless otherwise noted. THERMAL INFORMATION THERMAL METRIC(1) RHA (40 PIN) UNITS θJA Junction-to-ambient thermal resistance 32 θJB Junction-to-board thermal resistance 10 °C/W θJCbot Junction-to-case (bottom) thermal resistance 3.4 (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. RECOMMENDED OPERATING CONDITIONS over operating free-air temperature range, all voltages wrt GND (unless otherwise noted) MIN TYP MAX UNIT Conversion voltage (no pin assigned) 3 28 Supply voltages V V5IN, V5FILT 4.5 5.5 VBST1, VBST2 –0.1 34 Voltage range, conversion DRVH1, DRVH2 –0.8 34 V pins LL1, LL2 –0.8 28 CSN1, CSN2, CSP1, CSP2, DROOP, DRVL1, DRVL2, IMON, Voltage range, 5-V pins MODE, OSRSEL PG, PGD, SLEW, THRM, TONSEL, TRIPSEL, –0.1 5.5 V VREF, VFB Voltage range, 3.3-V pins EN –0.1 3.6 V Voltage range, VCCP I/O PCNT, VID0, VID1, VID2, VID3, VID4, VID5, VID6, VID7, THAL –0.1 1.3 V pins Ground pins PGND, GFB –0.1 0.1 Human body model (HBM) 2 Electrostatic Discharge kV Protection (ESD) Charged device model (CDM) 1.5 Operating free air temperature, TA –10 105 °C 2 Submit Documentation Feedback Copyright © 2013, Texas Instruments Incorporated Product Folder Links: TPS53624 |
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