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TPS40200-Q1 Datasheet(PDF) 4 Page - Texas Instruments |
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TPS40200-Q1 Datasheet(HTML) 4 Page - Texas Instruments |
4 / 46 page TPS40200 SLUS659G – FEBRUARY 2006 – REVISED NOVEMBER 2014 www.ti.com 6 Specifications 6.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) MIN MAX UNIT VDD , ISNS –0.3 52 Input voltage range RC, FB –0.3 5.5 V SS –0.3 9.0 COMP –0.3 9.0 Output voltage range V GDRV VIN –10 VIN TJ Operating Junction Temperature –40 125 °C Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds 260 (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. 6.2 Handling Ratings MIN MAX UNIT Tstg Storage temperature range –55 150 °C Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all –1500 1500 pins(1) V(ESD) Electrostatic discharge V Charged device model (CDM), per JEDEC specification –1500 1500 JESD22-C101, all pins(2) (1) JEDEC document JEP155 states that 500 V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250 V CDM allows safe manufacturing with a standard ESD control process. 6.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT VDD Input voltage 4.5 52 V TJ Operating temperature range –40 125 °C 6.4 Thermal Information D DRB THERMAL METRIC(1) SOIC VSON UNIT (8 PINS) (8 PINS) RθJA Junction-to-ambient thermal resistance 109.6 44.2 RθJC(top) Junction-to-case (top) thermal resistance 54.0 53.6 RθJB Junction-to-board thermal resistance 49.6 19.8 °C/W ψJT Junction-to-top characterization parameter 11.2 1.1 ψJB Junction-to-board characterization parameter 49.1 19.9 RθJC(bot) Junction-to-case (bottom) thermal resistance N/A 7.9 (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. 4 Submit Documentation Feedback Copyright © 2006–2014, Texas Instruments Incorporated Product Folder Links: TPS40200 |
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